The present disclosure provides a probe cable assembly comprising a probe interface configured to couple to a measurement interface and to receive a differential signal, a measurement output interface configured to output the differential signal, and a cable arrangement electrically arranged between the probe interface and the measurement output interface and configured to conduct the differential signal between the probe interface and the measurement output interface, the cable arrangement comprising a cable, a plurality of magnetic elements arranged around at least a section of the length of the cable, wherein each magnetic element is separated by a gap from adjacent magnetic elements, and a plastically deformable guiding element configured to fix the cable arrangement with a predetermined relative position between the probe interface and the measurement output interface.

A touch screen testing platform may be used to engage a dynamically positioned target feature being displayed on a touch screen enabled device during a testing protocol. The platform may record imagery displayed by the touch screen device and then analyze the imagery to locate the target feature within a reference coordinate system. The platform may recognize that the target feature is missing from the imagery and respond by causing the touch screen device to scroll through a command menu and/or toggle through virtual screens. Once located, the platform may instruct a robotic device tester to select the target feature by contacting the touch screen at the identified location using a conductive tip designed to simulate a user's fingertip. Prior to running a test, the camera may be focused to a point that is offset from the display screen of the touch screen device.

A probe assembly and a micro vacuum probe station comprising same are disclosed. A probe assembly according to one embodiment may comprise: a base; a guide rail installed on the base; a guide member sliding along the guide rail; a probe connected to the guide member and of which one side contacts a wafer to inspect electrical properties of the wafer; and a thin film connector connected to the other side of the probe so as to supply electricity to the probe.

A fastener locating tool equipped with a sensor head having one or more probes and a method for operating such a tool for precisely locating a fastener that is hidden or buried under a thick coating applied on a surface of a structure. The fastener locating tool may be manually or automatically operated. The fastener locating tool includes a platform having a central opening, means for temporarily attaching the platform to a coated surface, and a sensor head that may be easily mechanically coupled to and then later decoupled from the platform. Optionally, the fastener locating tool also includes a multi-stage positioning system with X and Y stages which may be used to adjust the position of the sensor head. The sensor head includes at least one probe which generates electrical signals indicating the presence of a fastener beneath a coating when the probe is within a detection range.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A method for testing printed circuit boards (20) in a test apparatus having a carrying apparatus for the printed circuit board (20) and having test modules for measuring physical variables of components (EB) and contact points (29) on the printed circuit board (20), in which the width of the printed circuit board (20) defines an X direction, its length defines a Y direction and its thickness defines a Z direction inside the test apparatus, reference points, the X, Y and Z positions of which relative to the carrying apparatus are known, are present on the printed circuit board (20) or outside the latter, the X and Y positions of the components (EB) and contact points (29) relative to the reference points are known, the measurement of the physical variables depends on an actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured, and the actual Z position of the printed circuit board at the X and Y positions of the component (EB) or contact point (29) to be measured is determined by means of an interpolation method starting from the X, Y and Z positions of selected reference points.

A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading.

A staggered probe card and a conductive probe are provided. The staggered probe card includes an upper guide board, a lower guide board spaced apart from the upper guide board, and a plurality of conductive probes arranged in rows and passing through the upper and lower guide boards. Each of the conductive probes has an elongated structure defining a longitudinal direction, and includes a bottom surface and two long side surfaces respectively connected to two edges of the bottom surface. A distance between the two long side surfaces gradually decreases in a tapering direction that extends away from the bottom surface. In two of the rows of the conductive probes adjacent to each other, any two long side surfaces respectively belonging to the two adjacent rows and arranged adjacent to each other have a lateral interval along a direction that is non-parallel to the arrangement direction.

A system and methods are provided for robot-assisted, interactive testing of electronic circuits comprising a test fixture comprising a robotic arm, a probe, and a bracket configured to hold a unit-under-test, wherein the probe is configured to be mounted on the robotic arm and to perform a probe action, and a computer system communicatively connected to the test fixture and comprising a graphics display, a user input device. The computer system is configured to present on the graphics display a logic schematic of the unit-under-test, to receive a user selection of a target element shown on the logic schematic, to determine the corresponding physical location on the unit-under-test of said element, to move the probe to the physical location of the target element, by means of the robotic arm, and to perform one or more probe actions.

A probe unit and a holder of a measurement apparatus that can be releasably connected to one another, particularly without tools, are disclosed. The probe unit includes a mounting device having a contact surface and the holder comprises a counter-contact surface assigned to the contact surface. The contact surface can be divided into multiple separate surface sections that respectively abut along a line or two-dimensionally against the assigned counter-contact surface, if the mounting device takes a contact position. The holding force is produced by at least one mounting magnet of the mounting device and/or at least one holding magnet of the holder. Thereby a magnetic axial force in an axial direction as well as a magnetic circumferential force in a circumferential direction around the axial direction is created, so that the mounting device and holder are urged relative to one another in a desired rotational position in the circumferential direction.