A plurality of batteries is stacked, together with spacers, in a compressed state. Charging and discharging units are arranged facing lead terminals protruding from the batteries and are independently operable for the respective batteries. The charging and discharging units each independently include substantially V-like shaped power-side and measurement-side contact elements elastically supported by compression coil springs and having floating freedom. When the batteries are moved all together toward the charging and discharging units, front end surfaces of the lead terminals are pressed against and electrically connected to flat surfaces of the power-side and measurement-side contact elements. By this, it is possible to smoothly perform charging and discharging inspection on the batteries even when the lead terminals protruding from the battery package are subjected in advance to surface treatment.

An electronic device for testing of semiconductor components with test needles includes an electric power source, a plurality of test needles connected with the electric power source, a plurality of electric circuits, each one of the electric circuits connected upstream of one of the test needles, each one of the electric circuits including at least one circuit component which has low resistance in a range of electric currents and has high resistance above a given limit electric current, a control voltage source connected with each one of the electric circuits, and two DC/DC converter circuits connected between the control voltage source and the electric circuits.

Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.

A testing device for testing an electronic device includes a base, a testing mechanism, a pushing mechanism, and a fastening mechanism. The testing mechanism is rotatably fastened to the base and can be rotated from a first position to a second position. The fastening mechanism is mounted on the base. The pushing mechanism is rotatably mounted on the testing mechanism. When the testing mechanism is rotated from the first position to the second position, the pushing mechanism is rotated and pushes against the testing mechanism. The testing mechanism is connected to an electronic device. The testing mechanism is positioned in the second position via the fastening mechanism.

Systems and methods for providing an enhanced user experience at an event or venue are provided. The systems and methods provided herein provide venue-specific location-based services to the user through the user's mobile device. Such services include allowing a user to order merchandise and concessions from their seat using their mobile device and delivering the ordered items to their seat. Such services also include determining a user's seat location from a scanned code on the user's ticket and providing a map to and from their seat.

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

A semiconductor device includes a leadframe having a first level and a second level. The semiconductor device includes a semiconductor die and a conductive alloy. The conductive alloy is between the semiconductor die and the first level of the lead frame. The conductive alloy is configured to be a current sense element. The semiconductor device further includes a first conductive post coupling the semiconductor die to the conductive alloy, a second conductive post coupling the semiconductor die to the conductive alloy, and a third conductive post coupling the semiconductor die to the second level of the lead frame. The second conductive post is configured to be a first sense terminal. The third conductive post is configured to be a second sense terminal.

The present invention provides a probe apparatus, which comprises a signal transmission device, a probe, and a bottom fixing device. The signal transmission device includes a first transmission part and a second transmission part. An end of the probe is connected electrically below the second transmission part. The bottom fixing device is disposed below the signal transmission device. An end of the bottom fixing device includes a first penetrating hole and a first recess is disposed below the end. The probe passes through the first penetrating hole of the bottom fixing device. The probe is located in the first recess. The bottom fixing device reinforces the mechanical strength of the signal transmission device so that the width of the signal transmission device can be reduced. Thereby, the benefit of high-density arrangement of the probe apparatus can be achieved.

An electrical connecting device (1) includes probes (10), and a probe head (20) including a middle guide plate (23) arranged between a top guide plate (21) and a bottom guide plate (22) and closer to the bottom guide plate (22) so as to lead the probes (10) to penetrate therethrough. The top guide plate (21) and the middle guide plate (23) are provided with guide holes through which the probes (10) are inserted at positions shifted between the top guide plate (21) and the middle guide plate (23) so as to lead the probes (10) to be held in a bent state between the top guide plate (21) and the middle guide plate (23). The probes (10) have a structure easier to bend at a region excluding a maximum stress part than at the maximum stress part defined at a position at which a maximum stress is applied to the probes (10) buckled when tip end parts of the probes (10) are brought into contact with an inspection object.

In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.