A high-frequency-based measuring device for determining a temperature-compensated dielectric constant of a medium includes a measuring probe having an electrically conductive inner conductor and an outer conductor. The inner conductor is rod-like along an axis. The inner wall of the outer conductor is symmetrical about the axis of the inner conductor and expands along the axis toward the medium. The measuring device includes a temperature sensor located in a first end region of the inner conductor, toward which end region the inner wall of the outer conductor expands. One of the temperature sensor terminals is at the potential of the inner conductor. The temperature of the medium is measured directly, without impairment of the high-frequency-based measurement of the dielectric constant. A highly accurate measurement of the dielectric constant and highly accurate temperature compensation are thereby made possible.

Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.

A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

A probe pin includes: a reference axis extending along a longitudinal direction of the probe pin; a head portion, which includes, in a sequential order along the reference axis, a sensing end, at least one positioning recess, and a first spring engaging portion; a bottom portion, including a connecting end; and a spring, disposed between the top and bottom portions, wherein the spring encircles and engages with the first spring engaging portion, and abuts the bottom portion.

A cantilever probe card and a probe module thereof are provided. The probe module includes a supporting board, a substrate disposed on the supporting board, a plurality of cantilever probes, and a plurality of fine adjustment members. The substrate has a non-planar shape and has a difference of warpage along a testing direction. One end of each of the cantilever probes is connected to the substrate, and another end of each of the cantilever probes is a free end. The fine adjustment members are spaced apart from each other and are disposed between the supporting board and the substrate. Each of the fine adjustment members is configured to be independently operable along the testing direction for changing a distance between the supporting board and the substrate. The substrate is deformable through at least one of the fine adjustment members so as to reduce the difference of warpage.

A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

The present disclosure provides a test apparatus and a jumper thereof. The test apparatus includes a base board and the jumper. The base board has a first slot and a second slot. The first slot has a plurality of electrical contacts, and is configured to receive a plurality of pins of a device under test. The jumper is inserted into the second slot. The jumper includes a body and a plurality of first circuits. The first circuits are disposed on the body and electrically connect the electrical contacts of the first slot to a plurality of pins of a tester.

An electrical connecting device having one or more contact members to be in contact with a contact target is provided. The electrical connecting device includes a main body having one or more recesses on a surface thereof opposed to the contact target, and a flexible portion that covers the recesses to form sealed spaces. The main body includes a gas exhaust passage and an air supply passage provided for each of the sealed spaces to adjust a pressure in each of the sealed spaces, and the contact members are respectively disposed to be opposed to the recesses with the flexible portion interposed therebetween.

Provided is an immunity evaluation system that enables design feedback in consideration of a subject wiring and an improvement amount for improving an electromagnetic noise resistance of a circuit board. An immunity evaluation device includes: a storage unit configured to store characteristic data including probe-circuit board wiring coupling characteristics which are determined by a combination of a near-field probe and circuit board characteristics, and a test result; and an IC reaching signal level estimation unit configured to estimate a signal level reaching a terminal of an evaluation target IC. The immunity evaluation device receives board design information, information of the near-field probe, and test waveform instruction information of a signal applied to the near-field probe. The IC reaching signal level estimation unit reads the coupling characteristics from the storage unit based on the board design information of a test subject circuit board and the information of the near-field probe, and outputs a value of the IC reaching signal level reaching a terminal of the evaluation target IC from the board design information of the test subject circuit board, the information of the near-field probe, and the coupling characteristics.

The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.