A test adapter apparatus comprising at least one device under test, DUT, holder adapted to hold a device under test, DUT and adapted to be plugged in into a docking station of said test adapter apparatus, wherein the docking station has RF and data interfaces used for connecting at least one external test device through said docking station with the device under test, DUT, held by said device under test holder.

In a method of testing a semiconductor wafer, a probe tip contacts a pad in a scribe line space between facing sides of first and second dies. The probe tip is electrically coupled to an automated test equipment (ATE). The second die is spaced apart from the first die. The scribe line space includes an interconnect extending along at least an entire length of the facing sides of the first and second dies. The pad is electrically coupled through the interconnect to at least one of the first or second dies. With the ATE, circuitry is tested in at least one of the first or second dies. The pad is electrically coupled through the interconnect to the circuitry.

An optical transmission device includes: a substrate; a waveguide that is provided in the substrate and transmits an optical signal; a signal wiring that is provided in the substrate and transmits an electric signal; and a silicon wiring that is provided in the substrate and is silicon added with an impurity. The signal wiring is placed in an area of the substrate, the area being away from an end of the substrate by a predetermined distance or more. One end of the silicon substrate is connected to the signal wiring, and the other end of the silicon wiring extends to the end of the substrate.

A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal conductor extending between the first end and the second end of the transmission line arrangement, a first conducting sheet and a second conducting sheet positioned on two opposing sides of the signal conductor, an insulating material separating the first and second conducting sheets from the signal conductor and a plurality of pieces of conducting material extending between the first and second conducting sheets and arranged at different positions between the first and second ends of the transmission line arrangement, wherein the pieces of conducting material and the conducting sheets are arranged to substantially surround the signal conductor for at least part of its length between the first and second ends of the transmission line arrangement.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

A probe head may be utilized to test an electronic device. The probe head may include a probe axis extending along a length of the probe head. The probe head may include a probe core including a first metal. The probe core may include a core surface having a first dimension. The first dimension may be perpendicular to the probe axis. The probe core may include a probe tip, for instance extending from the core surface along the probe axis. The probe tip has a second dimension that may be perpendicular to the probe axis. The second dimension may be less than the first dimension of the core surface. The probe head may include a cladding layer that includes a second metal. The cladding layer may be coupled around a perimeter of the probe core. The probe tip may extend beyond the cladding layer.

A method for manufacturing probes includes forming a recessed portion on a plate such that the plate has a first subsidiary plate, a second subsidiary plate and a third subsidiary plate mutually connected. The first subsidiary plate has a first thickness. The second subsidiary plate corresponds to the recessed portion and has a second thickness. The first thickness is larger than the second thickness. The second subsidiary plate is located between the first subsidiary plate and the third subsidiary plate. The third subsidiary plate has a third thickness. The third thickness is larger than the second thickness. Subsequently, the plate is held and cut by laser to form a plurality of probes. Each of the probes includes a probe tail formed from the first subsidiary plate, a probe body formed from the second subsidiary plate and a probe tip formed form the third subsidiary plate.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

The present disclosure provides a test probe and an apparatus for testing a printed circuit board, wherein the test probe comprises a test pin; and an insulating protection sleeve with adhesive attached therein, wherein the insulating protection sleeve is sleeved on the test pin, and wherein a first end of the test pin protrudes from the insulating protection sleeve.

In a method of testing a semiconductor wafer including a scribe line and multiple dies, the method includes implementing a first landing pad on the scribe line, and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip, and applying an ATE resource to the first cluster of dies.