A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

Described herein are antenna-coupled radio frequency (RF) probes with replaceable tips. In the described embodiments, test signals are coupled onto a probe tip wafer via an on-tip antenna, thus the probe tip is decoupled from the probe body. This allows for separate fabrication of the probe body and the probe tip. As such, the probe tip can be made available as a “commodity” and the user can simply replace a worn-out or damaged probe tip, providing significant savings in per-unit cost and operation cost of the new contact probes. The decoupling of probe tip and probe body allows for manual replacement of probe tip without the need for extremely accurate alignment which is typically required in extremely high frequency probes. Manual replacement of the tips is only possible due to the much less stringent alignment requirements afforded by the antenna coupling from the probe body to the probe tip.

A method that includes changing a probe angle with respect to the conductor surface of a substrate that has a flat conductor surface mounted on the mounting surface of a stage in a high-frequency test system, thereby changing the state of contact of the tip of a signal terminal and tip of a ground terminal with the conductor surface, outputting high-frequency signals from the signal terminal to the conductor surface and receiving reflected signals using the probe to find S-parameters at different probe angles, and determining, based on a plurality of the S-parameters, a reference probe angle at which the reference line formed connecting the tip of the signal terminal and tip of the ground terminal is parallel with the conductor surface.

The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

A resistance-measuring device mountable to a component of a current-carrying transmission line. The device includes a body having a base and two arms with interconnected first ends and spaced-apart second ends. The arms define a gap therebetween. Each arm has an inner portion facing the gap. The body is displaceable to mount the body about the component and position the component within the gap. The body has an abrading mechanism mounted to the arms. The abrading mechanism has an electrically-conductive abrading element disposed along the arm and facing inwardly toward the gap. The abrading element rubs against an outer surface of the component upon displacing the body to mount the body about the component. A method is also disclosed.

Disclosed is a test and measurement probe including a signal channel having an input series resistor with a series parasitic capacitance. The probe also includes an amplifier coupled to the signal channel. The amplifier includes a shunt parasitic capacitance. A variable shunt resistor is coupled to the signal channel and a ground. The variable shunt resistor can be set to match a resistance capacitance (RC) value associated with the series parasitic capacitance and the shunt. The probe can also include a variable series resistor coupled to the amplifier. The variable series resistor can be set to adjust for attenuation variation associated with the variable shunt resistor. Other embodiments may be described and/or claimed herein.

A probe chip device and a method for fabricating a probe chip device with an integrated diode sensor are disclosed. In one example, a probe chip device includes a beam head element that includes at least one probe tip that is configured to electrically probe a device under test. The probe chip device further includes a diode sensor that is heterogeneously integrated on the beam head element and is proximally positioned to the at least one probe tip.

A test-probe tip having a tip component, a resistive element, and a compliance member. The tip component is configured to electrically connect to a device under test at a first end of the tip component. The resistive element is electrically connected to a second end of the tip component along a signal-flow axis. The resistive element is configured to provide electrical impedance to an electrical signal passing through the resistive element. The compliance member is configured to allow movement of the tip component in a first direction when a mechanical force applied to the tip component in the first direction and to cause movement of the tip component in an opposite, second direction when the mechanical force applied to the tip component is removed or reduced. Architectures for the resistive element are also described.

A test point adaptor includes a body having a first and second end along a longitudinal axis. The second end includes an outer conductive sleeve. A cap includes a sleeve and a terminator. The body includes a first and second interface at the first and second ends, respectively. A center conductor extends though the body from the first interface toward the second interface. The second end includes a conical contact surface of the outer conductive sleeve. The cap matingly engages the second interface. The second end includes an electrically conductive contact member in electrical contact with the center conductor and a gripping arrangement electrically coupled with the electrically conductive contact member. The cap includes a conical contact surface to engage the conical contact surface of the outer conductive sleeve. A terminator is received by the gripping arrangement, which electrically couples the terminator to the center conductor.