A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer comprises a plurality of contact elements, each comprising a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements, the guide comprising a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

A probe for measurements on a device under test with low source impedance is described. The probe has a resistor coupled in series between a probe tip and a probe cable connected to a measuring apparatus. The resistor having an impedance equal to a characteristic impedance of the probe cable or equal to the difference between the characteristic impedance of the probe cable and an output resistance of the device under test. Further, a measuring system and a test setup are described.

A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.

A probe is connected to a signal conductor of a signal cable when used, and is capable of coming into contact with a signal conductor of a mating receptacle. The probe includes a barrel that is a tubular conductor and that is electrically connectable to the signal conductor of the signal cable; a plunger that is a conductor and has a proximal end disposed in the barrel and a distal end projecting from the barrel and is configured to come into contact with the mating receptacle; and a coil spring disposed in the barrel. The coil spring urges the proximal end of the plunger in a direction toward the distal end of the plunger. The barrel includes a contact portion that is in contact with the plunger at a position closer to a distal end of the barrel than the proximal end of the plunger.

The inspection socket includes: a contact terminal 80 including a barrel 82 having a flange section 90, a device-side terminal 84, and a board-side terminal 86; housings 10, 30, and 50 having through holes 10c, 30c, and 50c into which the contact terminal 80 is inserted; and housings 20 and 40 having through holes 20c and 40c into which the contact terminal 80 is inserted, the through holes 20c and 40c being larger than the outer diameter of the contact terminal 80 excluding the flange section 90 and smaller than the outer diameter of the flange section 90. The housings 20 and 40 are sandwiched between the housings 10, 30, and 50, the flange section 90 is contained in the through hole 50c, and the through holes 10c, 30c, and 50c are designed to have, for impedance matching, a gap from the outer periphery of the contact terminal 80.

Probe for testing a radio frequency device, test system and test method. A probe is used for measuring radio frequency signals provided by the device under test or for providing test signals to the device under test. In particular, the probe comprises a power detector directly connected to the contacting elements of the probe. Accordingly, such a power detector can provide a power signal highly correlated with the power signal of a radio frequency signal at input or output terminals connected to the probe.

The application provides a spring probe with high stability, which comprises a hollow syringe with a spring in it. The upper end and the lower end of the syringe has an upper thimble and a lower thimble respectively. There are two support rings at the outer clearance of the syringe, and a group of flanges for positioning the support rings at two sides of each support ring. The advantages of this application are that: the support ring can ensure that the spring probe is better fixed in the fixed plate without being pressed out, thereby better ensuring that the spring probe does not deviate beyond the tolerance range when used, and obviously improving the high frequency bandwidth by the support ring with low relative dielectric constant.

A radio frequency (RF) test probe adapter comprises a cable adapter operable for use with a RF test probe and a housing. The cable adapter comprises a cable connector configured to physically couple to a connector of a coaxial cable, a first pin operable to electrically couple a center conductor of the coaxial cable to a first lead of the RF test probe, and a second pin operable to electrically couple an outer conductor of the coaxial cable to a second lead of the test probe. The housing is sized and shaped to secure the RF test probe and the cable adapter in a physically coupled configuration

A hermetically sealed adjustable link for low loss coaxial airline connection between the seamless connection of coaxial RF connector of external instruments with 30- or 45-degrees wafer probes allows continuous, micro-positioner controlled, 3-axis horizontal and vertical probe movement. A flexible sealing ring ensures airtight and/or RF-EMI shielded operation. A metallic or plastic collar ensures wafer testing under EMI shielded and high temperature conditions.