A probe includes a first rod having a first axis and a second rod having a second axis. A first end of the first rod is connected to a first end of the second rod to form an angle that maintains a “total internal reflection” effect for waves propagating through the probe. A second end of the second rod includes a prong facilitating attachment of the probe to a housing block. The first axis and the second axis define a plane. A second end of the first rod includes a tapered face formed perpendicular to the plane. The tapered face is sufficiently flat to make planar contact with a portion of a component under study. A support is formed in the plane and connected to the second rod. A second end of the support includes a connector to facilitate attachment of the probe to the housing block.

The invention provides a high-frequency pawl spring probe applied to 5G, which comprises a sleeve with a hollow cavity inside with a spring in it. There is a pawl spring at the upper end in the sleeve; the pawl spring comprises a cylindrical pawl spring cylinder and the elastic sheets at the lower end of the pawl spring cylinder; and the pawl spring cylinder is in an interference fit with the sleeve. A plunger is set in the pawl spring, and the elastic sheets are in contact with the plunger. The advantages of this invention are that: the probe structure has good directivity with small fluctuation of resistance value, which can be used in vibration or under the fluctuating external force, thus avoiding the instantaneously cut-off of the probes at present. The application range is expanded, which well meets the requirements of the equipment reliability in the 5G era.

A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.

An RF signal processing system including multiple drop-in modular circuit blocks is disclosed. The drop-in modular circuit blocks include input and output launches exhibiting the same launch geometry. The RF system may include a conductive plate with a grid of holes disposed on the conductive plate. Multiple modular blocks may be installed on the conductive plate to form a cascade of modular blocks that exhibit common launch geometries. The cascade may include an RF probe with a projection and conductive pin that overhang a portion of a launch of a modular block at an end of the cascade. Flex connects may be disposed on, and held in position by, anchors to connect adjacent modular blocks together in a prototype system. A production RF system may exhibit the same overall geometry as a prototype RF system to speed up the transition from prototype design to production design.

A probe card for a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis (H-H) between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane which comprises a first face and a second and opposite face. Conveniently, the first portion of the flexible membrane is arranged on at least one support and comprises a plurality of strips extending between a proximal end and a distal end, the probe card further including a plurality of micro contact probes comprising a body extending along the longitudinal axis (H-H) between a first end portion and a second end portion, the second end portion of each contact element abutting onto the first face of the flexible membrane at the distal end of a respective strip, and the first end portion of each micro contact probe abutting onto the second face of the flexible membrane at a respective contact element, the flexible membrane being electrically connected to the support plate through a second portion thereof, the second end portion of the micro contact probes being apt to contact the contact pads of a device to be tested, wherein the at least one support is provided with a plurality of guide holes for the housing of the plurality of micro contact probes.

A test point adaptor for coaxial cables includes a main body, a test body, and a cap. The main body has a first longitudinal axis and includes a first end comprising a first interface, a second end comprising a second interface, and a first center conductor extending at least from the first interface to the second interface. The test body has a second longitudinal axis arranged transversely to the main body and includes an outer conductive sleeve, a test body end comprising a third interface, an electrically conductive contact member in electrical contact with the first center conductor, and a gripping arrangement electrically coupled with the electrically conductive contact member. The third interface includes a conical contact surface of the outer conductive sleeve. The cap includes a sleeve configured to matingly engage an outer surface of the outer conductive sleeve. The outer conductive sleeve includes a conical contact surface configured to engage the conical contact surface of the outer conductive sleeve when the cap is matingly engaged with the outer sleeve. The cap includes a terminator configured to be aligned with and received by the gripping arrangement, which electrically couples the terminator to the electrically conductive contact member.

The invention relates to a high-frequency test connector device (12; 12′) having an adapter housing including a sleeve-like ground contact section (10; 10′) axially at one end, (18) at the other end, and centrally an insulated inner contact (20), wherein the ground contact section has an electrically conducting spring member (26; 26′, 28; 42, 44; 44′, 46) for ground contact, associated such that for engaging over the sleeve section (14) of the contacting partner (16), the latter with an end face (30), to form a contact and resiliently along the movement or connecting longitudinal axis, can engage on the spring member (26) formed in a sleeve base of the ground contact section (10), or wherein, for engaging in the sleeve section (14′) of the connecting partner (16′), the spring member (26′) projects from an end face end section of the ground contact section (10′), to form a contact and resiliently along the longitudinal axis, can engage on a ground-conducting inner section (40) of the connecting partner.

An object of the present invention is to provide a prober that is able to carry out accurate inspection of semiconductor device in wafer state by reducing the effect of the external noises and the leakage of current and further by eliminating the stray capacitance of the chuck stage against the prober housing. The present invention attains this object by providing a prober comprising a chuck cover conductor that comprises a bottom conductor and a side conductor and an open top, wherein a chuck stage can be contained within a space surrounded by the bottom conductor and the side conductor; an upper cover conductor which has opening through which the conducting support members of the probe for front-side electrodes and the probe for back-side electrodes can be passed, and which is large enough to cover, in a plane view, at least the open top of the chuck cover conductor when the contact member of the probe for front-side electrodes moves relatively within a wafer under inspection; and, a conducting means that brings the chuck cover conductor and the upper cover conductor into contact and makes them electrically continuous.

A spring probe connector, a device and an assembly for interfacing a daughter card with a backplane. The spring probe connector includes a hollow barrel that defines a first opening and a second opening. The spring probe connector includes a plunger that is received by the first opening. The plunger includes a contact tip that protrudes from the first opening and makes electrical contact with the backplane. The spring probe connector includes one or more springs positioned within the hollow barrel and applies a load onto the plunger. The spring connector includes a contact end that protrudes from the second opening and connects with the printed circuit board of the modular connector assembly.

A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.