A spring probe connector, a device and an assembly for interfacing a daughter card with a backplane. The spring probe connector includes a hollow barrel that defines a first opening and a second opening. The spring probe connector includes a plunger that is received by the first opening. The plunger includes a contact tip that protrudes from the first opening and makes electrical contact with the backplane. The spring probe connector includes one or more springs positioned within the hollow barrel and applies a load onto the plunger. The spring connector includes a contact end that protrudes from the second opening and connects with the printed circuit board of the modular connector assembly.

Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected. An inspection signal supplied from an inspection device to the probes 3 is set as an alternating current signal, and the probe card 1 causes capacitive coupling between the needle tip parts 13 and the electrode of the object to be inspected, and transmits the inspection signal.

A structure and method for providing a housing which includes a high frequency (HF) connection between a device under test (DUT) having a wave port 20 and a load board via a waveguide structure. The waveguide includes a wave insert 42, a waveguide adapter 24 and a conductive compliant member 40 which maintains bias between the adapter 24 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT wave port. The adapter may also include a projection 64 which is received in a recess in the waveguide so that the shielding between the waveguide and adapter has full integrity.

A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.

A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.

An RF connection assembly is provided for DC to mmWave signals. The RF connection assembly includes a GTMS assembly including a shroud, glass insulation filling a portion of the shroud to define an inner recess, and a gold plated GTMS center conductor secured by the glass insulation and protruding from the inner recess; and a pin and bead assembly including an RF center conductor including a clamping mechanism having a collar, and a center socket defined by the clamping mechanism, the center socket being accessible through an opening in the collar. The collar has a smooth inner edge around a perimeter, configured to guide a tip of the GTMS center conductor into the center socket of the RF center conductor for connecting the GTMS assembly and the pin and bead assembly, minimizing scraping of the GTMS center conductor by the inner edge of the opening.

Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

An apparatus includes a carrier base and one or more contact elements coupled to a portion of the carrier base. The one or more contact elements are configured to sense an electrical signal flowing through at least one electrical component in a circuitry under test. The first contact element of the one or more contact elements comprises a power sense conductor extending from a bottom surface of the first contact element toward a top surface of the first contact element and a ground conductor electrically isolated from the power sense conductor.

A probe apparatus of a millimeter or submillimeter radio frequency band comprises transition layers having outermost layers on opposite surfaces of the probe apparatus. An internal transition cavity extends through the transition layers for guiding electromagnetic radiation within the probe apparatus. A probe layer disposed between the transition layers, the probe layer having a lateral transmission line for interacting with the electromagnetic radiation guided by the internal transmission cavity.