A measurement probe for producing a test signal for a measurement instrument includes a probe head structured to be connected to at least a first testing point and a second testing point of a Device Under Test (DUT), a current detector in the measurement probe structured to determine a current flowing between the first testing point and the second testing point of the DUT, a first selectable signal path that causes a voltage signal from the first testing point or a voltage signal from the second testing point to be routed to the measurement instrument as a selected voltage test signal, and a second selectable signal path that causes a current signal from an output of the current detector to be routed to the measurement instrument as a selected current test signal. Methods of testing a DUT using the measurement probe are also described, as well as a system for measuring signals from a DUT using the measurement probe.

A test probe assembly includes: a conductive pipe; a probe inserted in the pipe without contacts and elastically retractable along a lengthwise direction; and an insulation probe supporting member configured to support the probe between an inner wall of the pipe and an outer surface of the probe. The test probe assembly of the present disclosure is improved in noise shield performance and convenient in repairing the probe since the probe is mounted to a probe socket as supported in a metal pipe without contacts.

An improved method and structure for forming an electrical interconnects mechanism in a Power Distribution Network (PDN) by placing capacitors on the top of the pin array on the printed circuit board (PCB) of the structure to decouple the PDN and results in lower impedance benefitting the frequency range of the PDN effecting a significant performance improvement in the spring-pin inductance from the transmission line. This reduction in impedance reduces the power supply ripple.

A high-frequency cantilever type probe card includes a base board, a probe base provided on the base board, two probes, and a capacitor having opposite ends electrically connected to the probes respectively. The probe base is made of an insulating material, and the probes are made of a conductive material. Each of the probes has an arm and a tip, wherein the arm is connected to the probe base, and the tip is adapted to contact a pad of a DUT. When the DUT generates a testing signal with a high frequency, and the testing signal is transmitted to one of the probes, the capacitor, and the other one of the probes in sequence, and then transmitted back to the DUT.

Herein is provided a device for optimizing bandwidth during oscilloscope measurements. The device is connectable to a probe for electrically connecting a test point and an oscilloscope. The device may include at least two grounding connectors with different inductances for electrically connecting ground to the probe and a tuning network comprising circuitry configured to compensate for the different inductances of said at least two grounding connectors, the tuning network being switchable between different modes, each mode being configured to compensate for a specific inductance of said at least two grounding connectors. A method for optimizing bandwidth during oscilloscope measurements is also provided.

A test probe tip can include a compliance member or force deflecting assembly and a tip component. The compliance member or force deflecting assembly can include a plunger component and a barrel component to receive the plunger component, wherein the plunger component is configured to slide axially inside the barrel component. The test probe tip can also include a spring mechanism within the barrel component to act on the plunger component, and a resistive/impedance element, e.g., a round rod resistor, coupled with the plunger component at one end and with the tip component at the opposite end.

A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections.

A high-precision magnetometer based on a miniature Penning trap is used to measure high magnetic field strengths with very high accuracy. Due to the high precision of the developed miniature charged particle trap, magnetic field strengths can be measured with an accuracy of 1 part per million or greater, including up to and above 1 part per billion. The charged particle trap has been configured to operate with such precision in environments of high radiation, e.g., 1 MGy or above.

An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.