A probe includes a first rod having a first axis and a second rod having a second axis. A first end of the first rod is connected to a first end of the second rod to form an angle that maintains a “total internal reflection” effect for waves propagating through the probe. A second end of the second rod includes a prong facilitating attachment of the probe to a housing block. The first axis and the second axis define a plane. A second end of the first rod includes a tapered face formed perpendicular to the plane. The tapered face is sufficiently flat to make planar contact with a portion of a component under study. A support is formed in the plane and connected to the second rod. A second end of the support includes a connector to facilitate attachment of the probe to the housing block.

The present disclosure provides a probe cable assembly comprising a probe interface configured to couple to a measurement interface and to receive a differential signal, a measurement output interface configured to output the differential signal, and a cable arrangement electrically arranged between the probe interface and the measurement output interface and configured to conduct the differential signal between the probe interface and the measurement output interface, the cable arrangement comprising a cable, a plurality of magnetic elements arranged around at least a section of the length of the cable, wherein each magnetic element is separated by a gap from adjacent magnetic elements, and a plastically deformable guiding element configured to fix the cable arrangement with a predetermined relative position between the probe interface and the measurement output interface.

The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L.sub.2 of the second contact probe 22 is shorter than the length L.sub.1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.

The inspection socket includes: a contact terminal 80 including a barrel 82 having a flange section 90, a device-side terminal 84, and a board-side terminal 86; housings 10, 30, and 50 having through holes 10c, 30c, and 50c into which the contact terminal 80 is inserted; and housings 20 and 40 having through holes 20c and 40c into which the contact terminal 80 is inserted, the through holes 20c and 40c being larger than the outer diameter of the contact terminal 80 excluding the flange section 90 and smaller than the outer diameter of the flange section 90. The housings 20 and 40 are sandwiched between the housings 10, 30, and 50, the flange section 90 is contained in the through hole 50c, and the through holes 10c, 30c, and 50c are designed to have, for impedance matching, a gap from the outer periphery of the contact terminal 80.

The present invention discloses a magnetic probe device. The magnetic probe device includes a magnetic probe body and a signal processing circuit, and an output end of the magnetic probe body is connected with an input end of the signal processing circuit; the signal processing circuit includes a first capacitor, a second capacitor, a Faraday shield and a step-up transformer, and the Faraday shield is fixedly arranged between a primary winding and a secondary winding of the step-up transformer; a center tap is arranged at the primary winding of the step-up transformer, and the center tap is grounded; and a first end of the primary winding is in series connection with the first capacitor, and a second end of the primary winding is in series connection with the second capacitor. The magnetic probe device provided by the present invention can improve the signal-to-noise ratio of a magnetic probe and the measurement accuracy of the magnetic field in plasma.

A probe unit includes: a plurality of contact probes each of which has one end that is brought into contact with a contacting electrode, the one end being an end in a longitudinal direction; a first ground member connected to an external ground; a second ground member provided around each of the contact probes; a connecting member electrically connected to the first ground member, and electrically connected to one end of the second ground member; and a probe holder configured to hold the contact probes, the first ground member, the second ground member and the connecting member.

A high-frequency-based measuring device for determining a temperature-compensated dielectric constant of a medium includes a measuring probe having an electrically conductive inner conductor and an outer conductor. The inner conductor is rod-like along an axis. The inner wall of the outer conductor is symmetrical about the axis of the inner conductor and expands along the axis toward the medium. The measuring device includes a temperature sensor located in a first end region of the inner conductor, toward which end region the inner wall of the outer conductor expands. One of the temperature sensor terminals is at the potential of the inner conductor. The temperature of the medium is measured directly, without impairment of the high-frequency-based measurement of the dielectric constant. A highly accurate measurement of the dielectric constant and highly accurate temperature compensation are thereby made possible.

A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

A high bandwidth differential test probe for measuring a device under test is provided. The test probe comprises a first probe tip arranged at a first coaxial connector relative to a first rotational axis, and a second probe tip arranged at a second coaxial connector relative to a second rotational axis. For adjusting the distance between the first probe tip and the second probe tip, the first coaxial connector is rotatable with respect to the first rotational axis and the second coaxial connector is rotatable with respect to the second rotational axis. Additionally, a tilt angle between the first probe tip and a plane comprising both the first and second rotational axes, and a tilt angle between the second probe tip and the plane, is not equal to zero.

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.