A sensor device is provided for detecting electrical defects in a device under test (DUT). The sensor device includes a signal line configured to conduct a stimulus signal through a first conductor in the DUT; an inductor connected in series with the signal line for providing an inductance; and a ground line arranged adjacent to the signal line and configured to provide a ground path through a second conductor in the DUT for the stimulus signal conducted through the signal line and the first conductor. A resonance frequency for the signal line is determined based on the inductance and an effective capacitance of the signal line generated in response to the stimulus signal. An increase in the resonance frequency indicates an open defect in the first conductor and/or the second conductor, and a decrease in the resonance frequency indicates a short defect between the first conductor and the second conductor.

The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.

The present disclosure provides a differential measurement probe comprising a first support plate, a second support plate arranged in parallel to the first support plate, a first printed circuit probe tip that comprises a first contact section for contacting a device under test, and a second printed circuit probe tip that comprises a second contact section for contacting a device under test, wherein the first printed circuit probe tip and the second printed circuit probe tip are arranged between the first support plate and the second support plate and are mechanically supported by the first support plate and the second support plate.

The present disclosure provides a probe device. The probe device includes a first probe structure and a second probe structure. The first probe structure includes: a first body, a first substrate and a plurality of first probes. The first substrate is disposed on the first body. The first probes electrically connects to the first substrate and protrudes from a surface of the first substrate. The second probe structure includes: a second body, a second substrate and a plurality of second probes. The second body has a plurality of through holes. The second probes electrically connects to the second substrate and protrudes from a surface of the second body through the through holes. The length of the first probe is different from the length of the second probes.

An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.

A cantilever-type probe with multiple metallic coatings is disclosed. The cantilever-type probe includes at least one probe pin. A first metallic coating is disposed upon a tip of the probe pin, and a second metallic coating is disposed upon a root of the probe pin. The second metallic coating is in contact with the first metallic coating and comprises a softer (more flexible) metal than the first metallic coating.

The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.