A test probe includes an electrically insulating handle, an electrically conducting blade extending from the handle, an electrically insulating shroud including a first portion and a second portion that are at least partially disposed around the electrically conducting blade. A housing is attached to the handle such that the first portion of the shroud is disposed within the housing, and the second portion of the shroud extends from an aperture formed in the housing. A spring disposed between the handle and the shroud biases the shroud toward the aperture formed in the housing. The shroud protects the electrically conducting blade from unintentional contact with a conductor during testing. When the test probe is correctly positioned on a device being tested, the shroud retracts into the housing exposing the electrically conducting blade. When the test probe is moved away from the device, the shroud returns to its original position.

A transducer for high-voltage measuring technology, including a housing having a parallelepipedal basic contour, input connections arranged on the housing and carrying input measurement signals in the high-voltage range, output connections arranged on the housing and carrying output signals in the low-voltage range, a transducer circuit arranged in the housing and implemented on a printed circuit board and being contact-connected to the input and output connections. The parallelepipedal basic contour of the housing is designed as an upright construction. The printed circuit board is arranged upright between opposite side walls of a dome formed in the housing. The input connections are arranged facing away from one another on the outer sides of the side walls within the basic contour of the housing, and in a manner engaging through the respective side wall of the dome are in contact with contact elements of the transducer circuit on the printed circuit board.

There is a need to improve estimation accuracy of a failure estimation method or its failure estimation apparatus that performs failure estimation on a targeted instrument based on history information about several instruments mounted with the same type of semiconductor device as an instrument targeted at failure estimation. A failure estimation apparatus that includes a history information database storing history information about a plurality of instruments mounted with the same type of semiconductor device and performs failure estimation on a targeted instrument mounted with a semiconductor device whose type equals the type, wherein the history information contains operation information and failure information; wherein the operation information indicates a chronological operating state of the semiconductor device mounted on the instruments; wherein the failure information indicates a failure cause of a failed instrument; and wherein the operating state is categorized into a plurality of classifications.

Embodiments of the invention provide for a circuit that detects a contact between a high-voltage power source and an electrically-conductive non-grounded device. A probe may conduct an electric potential from the electrically-conductive device to the circuit. A first leg of the circuit may shift the phase of the electric potential of the first leg relative to a phase of the electric potential of a second leg of the circuit. A voltage indicative of the phase difference of the electric potential between the first leg and the second leg may be measured. The detected voltage may be indicative of the contact between the high-voltage power source and the electrically-conductive device.

Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.

An electronic device for low-voltage electrical installations is provided. The electronic device includes a first operational unit having a first insulating housing, a data processing arrangement accommodated in the internal volume of the first operational unit and configured to receive and process detection signals indicative of one or more physical quantities and provided by one or more sensors, a flexible belt of magnetic material having an intermediate portion and opposite first and second end portions, a power supply arrangement configured to feed the data processing arrangement by harvesting electric energy from a magnetic field generated by a current flowing along the current carrying conductor, and a second operational unit configured to couple mechanically, in a removable manner, the first and second end portions of the belt of magnetic material one to another to secure the electronic device to the current carrying conductor.

A probe card includes a probe having a spring property and a probe head that holds the probe. The probe head includes a guide portion that holds the probe such that the probe can move in an axis direction Z. The guide portion includes a heat radiation structure that absorbs heat of the probe generated by energization and emits the heat to the outside of the probe.

A test assembly system protects a user from potentially energized equipment. Aspects of the system provide access to the equipment through a socket connection and a test probe assembly that is configured to interface with the socket connection to read voltage or continuity across a bus of the equipment being inspected. The probe assembly shields the user from the equipment to prevent energy or arc flashes from projecting out to contact the user.

Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.