A system and method for stress-testing of electronic components are disclosed. The system and method include a stationary bath including a tub that defines an aperture in a plane, in which a plurality of slots are positionable and defined inside the tub and oriented orthogonally with respect to the plane. A dielectric fluid in the tub is heated by a heating element to a predetermined temperature value. A board is configured to be retrievably placed with one of the plurality of slots, the board having a plurality of sockets operable to receive corresponding electronic components.

A probe card apparatus for wafer testing of a wafer under test, and a method of using the probe card for wafer testing. The probe card includes a printed circuit board having wafer testing circuitry. The probe card also includes a probe array including a slab having a plurality of probes, wherein each probe includes a volume of electrically-conductive fluid contained within a corresponding perforation of the slab that extends between a first surface and a second surface of the slab, wherein a first surface of each volume of electrically-conductive fluid substantially coincides with the first surface of the slab.

A Kelvin socket 10 comprising a housing 1 having a recess, a plurality of socket pin slots or partitions 11 resided in the recess, and a cooling medium pass 7; a plurality of self-cooling force contact fingers 2 arranged into an array and disposed into the plurality of socket pin slots or partitions 11 of the housing 1; wherein each of the plurality of self-cooling force contact fingers 2 has a force contact finger pin 21 and a heat sink base 22 being attached to a portion away from tip of the force contact finger pin 21 for dissipating heat from the force contact finger pin 21; an elastomer 3 disposed on the self-cooling force contact fingers 2; a plurality of sense contact fingers 4 having a plurality of sense contact finger pins 41, and being arranged into an array; wherein each of the plurality of sense contact fingers has a sense contact finger pin 41; wherein the plurality of sense contact fingers 5 are disposed into the elastomer 3, resulting in that the plurality of sense contact finger pins 41 are arranged in adjacent parallelly to the force contact finger pins 21; and a cover 5 disposed upon the sense contact fingers 4.

A system for testing an integrated-circuit wafer includes a probe card and a dispenser assembly. The probe card includes a circuit board and a probe needle coupled to the circuit board. The dispenser assembly is coupled to the probe card and is configured to deliver a metered amount of dielectric fluid to the tip of the probe needle. Methods are also disclosed.

A contact system (100; 100; 100) contains at least one pneumatically activated contact pin (121, 122, 123), a pressure chamber (1) and a first leadthrough (37; 37) which is in each case provided for each contact pin (121, 122, 123) in a housing (2) of the pressure chamber (1). Each contact pin (121, 122, 123) in each case has a first portion (141) with a first outer diameter and a second portion (142) which adjoins the first portion (141) and has a second outer diameter which is larger than the first outer diameter. Each first leadthrough (37; 37) has a first portion (131; 131) which faces away from the pressure chamber (1) and has a first inner diameter, and a second portion (132; 132) which faces the pressure chamber (1) and has a second inner diameter which is larger than the first inner diameter. The second portion (142) of each contact pin (121, 122, 123) is guided in an axially movable manner in the second portion (132; 132) of the first leadthrough (37; 37). For the contact connection, the first portion (141) of the contact pin (121, 122, 123) is led through in the first portion (131; 131) of the first leadthrough (37; 37). A certain axial position of each contact pin (121, 122, 123) in the associated first leadthrough (37; 37) corresponds to a certain pressure level of a pressure medium in the pressure chamber (1). The pressure medium is temperature-controlled.

The present disclosure relates to a micro-fluidic probe card that deposits a fluidic chemical onto a substrate with a minimal amount of fluidic chemical waste, and an associated method of operation. In some embodiments, the micro-fluidic probe card has a probe card body with a first side and a second side. A sealant element, which contacts a substrate, is connected to the second side of the probe card body in a manner that forms a cavity within an interior of the sealant element. A fluid inlet, which provides a fluid from a processing tool to the cavity, is a first conduit extending between the first side and the second side of the probe card body. A fluid outlet, which removes the fluid from the cavity, is a second conduit extending between the first side and the second side of the probe card body.

A probe connector includes a probe body, a flexible sleeve body, a slit and a conductive fluid. The flexible sleeve body is connected to the probe body. The conductive fluid is received in the flexible sleeve body and electrically connected to the slit and the probe body. The slit is formed on one end of the flexible sleeve body opposite to the probe body, so as to define petal portions which are configured to be tightly closed together. When the slit is pressed to separate the petal portions, a portion of the conductive fluid seeps up from the flexible sleeve body via the slit.

A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.

A vascular sap measurement sensor includes an indicator electrode probe, a reference electrode probe, and a supporting portion. The indicator electrode probe is an ion-sensitive field effect transistor. The reference electrode probe includes a solid reference electrode, the solid reference electrode including a base layer, a silver chloride layer, and a chloride layer, the base layer being formed of an electrically conductive body, the silver chloride layer being formed on a surface of the base layer, the chloride layer being formed on a surface of the silver chloride layer. The supporting portion supports the indicator electrode probe and the reference electrode probe arranged in parallel.

The present disclosure provides a biosensor device wafer testing and processing methods, system and apparatus. The biosensor device wafer includes device areas separated by scribe lines. A number of test areas that allow fluidic electrical testing are embedded in scribe lines or in device areas. An integrated electro-microfluidic probe card includes a fluidic mount that may be transparent, a microfluidic channels in the fluidic mount in a testing portion, at least one microfluidic probe and a number of electronic probe tips at the bottom of the fluidic mount, fluidic and electronic input and output ports on the sides of the fluidic mount, and at least one handle lug on the fluidic mount. The method includes aligning a wafer, mounting the integrated electro-microfluidic probe card, flowing one or more test fluids in series, and measuring and analyzing electrical properties to determine process qualities and an acceptance level of the wafer.