The present disclosure relates to an in-situ testing device including a measuring head, a drive mechanism, and a testing chamber. The testing chamber is provided with a first optical observation hole. The measuring head is provided with a second optical observation hole. The testing chamber is provided with an opening allowing the measuring head to pass. The testing chamber is further provided with a shielding door, and the drive mechanism is connected to the shielding door to drive the shielding door to move relative to the testing chamber, to open or cover the opening, thereby opening or closing the testing chamber.

An inspection system includes an inspection device that includes a stage on which a substrate is mounted and inspects the substrate on the stage, a temperature adjustment mechanism that adjusts the temperature of the stage, a substrate accommodating part, a temperature measurement substrate standby part that makes a temperature measurement substrate wait, a transfer unit that transfers the substrate and the temperature measurement substrate onto the stage, and a camera used for aligning the substrate on the stage. The temperature measurement substrate includes, on the surface thereof, a temperature measurement member whose state changes depending on the temperature. The transfer unit transfers the temperature measurement substrate onto the stage, the camera images the temperature measurement member, and the temperature of the temperature measurement substrate is measured from a change in the state of the temperature measurement member.

A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

A testing apparatus includes a first coordinates obtaining unit, a second coordinates obtaining unit, and a controller that performs determining card gravity center coordinates of a probe card held at a pogo frame opposite to an alignment stage, determining reference coordinates in a target coordinate system of a reference target at predetermined coordinates, determining alignment coordinates when the first coordinates obtaining unit is aligned with the second coordinates obtaining unit, determining wafer gravity center coordinates of a wafer, and calculating contact coordinates by using the determined card gravity center coordinates, the determined alignment coordinates, and the determined wafer gravity center coordinates. The controller further performs determining actual contact coordinates at the calculated contact coordinates, calculating reference contact coordinates based on the determined reference coordinates, and correcting a position of the alignment stage based on a positional difference between the determined actual contact coordinates and the calculated reference contact coordinates.

Provided is a technique capable of improving test efficiency of semiconductor devices. A test apparatus includes a probe card having a plurality of measurement sites that contact with a plurality of semiconductor devices formed on a semiconductor wafer; a control unit configured to generate map information, probe-card form information, and contact-position information, the map information including position information and peculiar information of the semiconductor devices on the semiconductor wafer, the probe-card form information including arrangement information of the measurement sites, the contact-position information indicating a contact position that is a range of the semiconductor device tested at one time by the probe card based on constrained-condition information of limiting contact with the probe card; and a position control unit configured to control a relative position between the probe card and the semiconductor wafer based on the contact-position information.

The disclosure performs a pre-test that checks electrical connections between each electrical contact of the socket and the corresponding pin of the semiconductor chip during a pre-test stage before a burn-in test. The electrical connection between each of the electrical contacts and each of the pins may be checked through multiple signal channels. Even when one of the signal channels failed, the pre-test and the burn-in test may still be performed as long as another one of the signal channels passes the pre-test. In addition, the pre-test stage through multiple signal channels also provides information for determining whether the failure of semiconductor chip is caused by the electrical connection between the socket of the burn-in board or the semiconductor chip itself.

A method for compensating to a first distance between a probe tip and a device under test (DUT) after a temperature change of the DUT includes: capturing a first image having the probe and its reflected image on a reflective surface of the DUT at a first temperature; measuring a second distance between a reference point of the probe and its reflected image; changing the first temperature of the DUT to a second temperature; capturing a second image having the probe and its reflected image on the reflective surface at the second temperature; measuring a third distance between the reference point of the probe and its reflected image; dividing the difference between the third and the second distances by two to obtain a fourth distance; and determining a relative position between the probe and the DUT by the fourth distance to compensate to the first distance.

A system is provided for detecting a forcer misalignment, e.g., due to forcer loss of registration (FLR), in a wafer prober used for electrical testing of a semiconductor wafer. The system includes an optical sensor system including a transmitter and receiver affixed to the forcer or to a reference structure (e.g., the prober platen), and a reflector affixed to the other one of the forcer or reference structure. The transmitter emits radiation toward the reflector, which reflects the radiation toward the receiver. The receiver detects the reflected radiation, and generates an output signal indicating the quantity of received radiation. Alignment monitoring circuitry is configured to identify a misalignment of the forcer relative to the reference structure (e.g., platen) based on the output signal generated by the receiver, and in response, output an alert signal, e.g., to suspend operations of the prober and/or display an error notification to an operator.

A probe pin inspection mechanism a includes a base, a pair of movable bodies, a pair of movable-body elastic bodies, and a conductor. The movable bodies are supported by the base to be movable in a first direction from a first position with respect to the base, and respectively include ends and terminals electrically connected to the respective ends. The movable-body elastic bodies elastically press the movable bodies in a second direction. The conductor is supported by the base and electrically connects the terminals of the movable bodies by making contact with the terminals. The state between the terminals and the conductor is switched, according to the position of the movable bodies, between a conductive state in which the terminals and the conductor are in contact with each other and a non-conductive state in which the terminals and the conductor are separated from each other.

A sensor assembly and sensing method is provided for proximity detection for assessing an attachment state of a sensing probe with respect to a subject. A probe is coupled to an electronic probe controller. The probe includes a proximity sensor having a passive energy storing circuit element, and a biological sensor receptacle configured to receive a biological sensor for sensing a biological characteristic of an object. The electronic probe controller excites a circuit network incorporating the proximity sensor with an excitation signal and determines a characteristic of the circuit network that is excited by the excitation signal. The electronic probe controller further generates a proximity indication indicating whether the probe is attached to the object based on the characteristic of the circuit network.