A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

An isolated voltage probe includes: a conductor including a positive lead, a negative lead, and a resistance via which the positive lead and the negative lead are connected to each other; a magnetic sensor for measuring a magnetic field in a non-contact manner, the magnetic field being generated by a current flowing through the conductor; and a coaxial cable for transmitting a signal that is based on an output supplied from the magnetic sensor.

An illumination device is provided. The illumination device includes a light source and a current path configured to transport a supply current to the light source. Further, the illumination device includes a sensor configured to contactlessly measure a current strength of the supply current in the current path and to output a measurement signal indicative of the measured current strength. The illumination device additionally includes processing circuitry coupled to the sensor and configured to determine the optical output power of the light source based on the measured current strength indicated by the measurement signal.

An illumination device is provided. The illumination device includes a light source and a current path configured to transport a supply current to the light source. Further, the illumination device includes a sensor configured to contactlessly measure a current strength of the supply current in the current path and to output a measurement signal indicative of the measured current strength. The illumination device additionally includes processing circuitry coupled to the sensor and configured to determine the optical output power of the light source based on the measured current strength indicated by the measurement signal.

A substrate processing apparatus includes: a chamber configured to perform a wet process and having an internal space, a chuck in the internal spaced and being configured for loading a semiconductor substrate thereon, a probe having an end above the chuck and including an electro-optical crystal and a reflective mirror on one surface of the electro-optical crystal, a measuring unit connected to the probe and configured to provide reference light to the probe, and to detect a polarization component of reflected light reflected from the one end of the probe by the reference light, and a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component.

A high voltage phasing voltmeter comprises first and second probes. Each probe comprises an electrode for contacting a high voltage electrical conductor. The electrodes are connected in series with a resistor. A meter comprises a housing enclosing an electrical circuit for measuring true rms voltage. The electrical circuit comprises an input circuit for connection to the first and second probes and developing a scaled voltage representing measured voltage across the electrodes. A converter circuit converts the scaled voltage to a DC signal representing true rms value of the measured voltage. A peak hold circuit is connected to the converter circuit to hold a peak value of the true rms value. A display is connected to the peak hold circuit for displaying the peak value of the true rms value.

An integrated circuit integrated on a semiconductor material die and adapted to be at least partly tested wirelessly, wherein circuitry for setting a selected radio communication frequencies to be used for the wireless test of the integrated circuit are integrated on the semiconductor material die.

The invention relates to a system in particular a quantum sensor system, for testing a device-under-test, DUT, comprising: an optically excitable medium which is arranged to receive electromagnetic, EM, radiation emitted by the DUT, at least one light source configured to irradiate the medium with at least one light beam, wherein the medium is optically excited by the at least one light beam, a field generator unit configured to generate an electric and/or magnetic field within the medium, wherein a resonance frequency of the excited medium is modified by an amplitude of the electric and/or magnetic field, wherein an optical parameter, in particular a luminescence, of the exited medium is locally modified if a frequency of the EM radiation corresponds to the resonance frequency at a position in the medium, an image detector configured to acquire an image of the medium, wherein the image shows an intensity profile that results from the modification of the optical parameter, a processor configured to analyze the DUT based on the acquired image.

Methods and apparatus for providing measurements in p-n junctions and taking into account the lateral current for improved accuracy are disclosed. The lateral current may be controlled, allowing the spreading of the current to be reduced or substantially eliminated. Alternatively or additionally, the lateral current may be measured, allowing a more accurate normal current to be calculated by compensating for the measured spreading. In addition, the techniques utilized for controlling the lateral current and the techniques utilized for measuring the lateral current may also be implemented jointly.

An automated circuit test system includes a magnetic sensor array configured to measure, at a plurality of locations, a magnetic field induced by a circuit under test. A circuit drive module can energize the circuit under test to induce the magnetic field. Optionally, the circuit drive module detects an electrical response from the circuit under test. Optionally, magnetic field data is combined with electrical response data prior to outputting the test result.