A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

Systems and methods for monitoring, characterizing and controlling operation of LEDs are provided herein. Methods includes measuring a voltage across the LED, and correlating the voltage to a junction temperature of the LED. This correlation can be used to improve operation of the LED by increasing the signal to noise ratio of the LED signal, characterize the LED by comparing to an I-V curve, control LED operation to compensate for LED degradation and avoid crosstalk, and/or to generally improve performance and life expectancy of the LED. Improved performance of the LED can include stabilizing the photon output during performance of an assay to provide a desired dye reporter signal required for the assay and/or reducing an intra-shot during of the LED output during the assay. System and device with control units configured to perform these methods are also described herein.

A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

The invention discloses a wafer testing device of flip chip VCSEL for testing a wafer having a plurality of light emitting units. The wafer testing device of flip chip VCSEL comprises a wafer testing carrier and a flexible conductive layer. The wafer testing carrier has a first surface. A plurality of testing portions are disposed on the first surface. The flexible conductive layer, detachably disposed on the first surface, are conductive in vertical direction and insulated in horizontal direction. Wherein the wafer is disposed on the flexible conductive layer, and each light emitting unit is electrically connected with one of the testing portions in vertical direction through the flexible conductive layer while testing the wafer.

Embodiments of the invention relates to a Solid-state optical receiver driver system, particularly for automotive applications, comprising at least one optical receiver channel, the optical receiver channel being connectable to a respective optical receiver, which is characterized in that the solid-state optical receiver driver system further comprises at least one test signal generation unit, for providing a test signal to the at least one optical receiver channel. The invention further relates to a method for testing a solid-state optical receiver driver system.

Herein disclosed are a method and a test probe for testing an electrical component. The electrical component comprises at least a first electrode and a second electrode. The method comprises the following steps: covering the first electrode with a first conducting flexible layer; driving a first electrode contact to electrically connect a first end of the first electrode contact with the first electrode via the first conducting flexible layer; covering the second electrode with a second conducting flexible layer; and driving a second electrode contact to electrically connect a second end of the second electrode contact with the second electrode via the second conducting flexible layer. The first conducting flexible layer is an anisotropic conductive film.

A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.

A repairing method for micro-LED chip defective pixels is disclosed. By providing a main recess and a backup recess in each of sub-pixel areas of a substrate, wherein each of the main recesses is loaded with a main micro-LED chip, when all of the main micro-LED chips are detected for defective pixels, the backup recess in each of the sub-pixel areas where the defective pixel is detected is loaded with a backup micro-LED chip using a fluid mass transfer method, which improves the repair efficiency.

An organic light emitting diode analyzer is provided to test electrical and spectroscopic characteristics organic light emitting diodes (OLED). The analyzer includes a spectrometer, a luminance and color meter, a header of the luminance and color meter, an OLED a source meter, an OLED holder and a computer. The OLED analyzer is a characterization system to measure the electrical and spectral characteristics and feature of the OLED. The luminance and color meter includes a color sensor, and the luminance and color meter measures a luminance of the OLED, a color temperature of the OLED, and color coordinates of the OLED. The spectrometer measures a wavelength of the OLED, an irradiance, a color index, the color temperature, color coordinates and the irradiance (W/m.sup.2.Math.nm). The source meter applies positive voltages to the OLED, and the source meter measures a current through the OLED.

The present disclosure relates to an optical sensor, comprising: a first circuit board having at least a data processing unit and an interface to a second circuit board, wherein the interface is connected with the data processing unit; and the second circuit board having an LED, a thermistor and a capacitor, which is connected in parallel with the thermistor, wherein the capacitor is embodied specifically for the LED, and an interface to the first circuit board, wherein LED, thermistor and capacitor are connected with the interface. The present disclosure relates also to a method for identifying an LED in an optical sensor.