A system may include a printed circuit board with a microstrip and a conductive structure surrounding the microstrip. The system may include a probe lead in communication with the conductive structure. The system may include a first contact pad electrically connected to the conductive structure and a second contact pad electrically connected to the conductive structure.

A method of connecting electrical substation wiring in an electrical substation provides pre-bundled yard cables configured to connect between field devices in the substation and a yard interface connection cabinet. The yard interface connection cabinet has an outside plug bulkhead plate that is accessible from outside of a control house that houses the yard interface connection cabinet. The outside plug bulkhead plate has a plurality of connectors configured to mate with the yard cables. The yard interface connection cabinet further has internal wires extending from an inside plug bulkhead plate and terminating at a terminal block. The connections and wires in the yard interface connection cabinet are tested with the yard cables before installation of the yard interface connection cabinet and yard cables in the substation. The yard cables are connected between the field devices and the outside plug bulkhead plate from outside of the control house.

A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

An apparatus is provided for testing a PCIe interface on a printed circuit assembly. The apparatus can include a plurality of electrical contacts to couple to a PCIe interface of the printed circuit assembly, wherein a respective electrical contact corresponds to a pin of the PCIe interface. The apparatus can also include a plurality of resistors. Each resistor is coupled between two adjacent electrical contacts. At least one electrical contact corresponds to a ground, power, or not connected (NC) pin of the PCIe interface, thereby allowing a loopback test to determine connectivity between the pins of the PCIe interface and the printed circuit assembly.

A method for factory analysis and/or maintenance, preferably including receiving factory information and/or associating defects with factory components, and optionally including acting based on defect associations and/or operating factory machines. The method is preferably associated with one or more manufacturing systems and/or elements thereof.

Techniques for determining a working state of an electronic component of an electronic device are described. The electronic component is coupled to the electronic device via a connection interface and a connector. The electronic device further comprises a contact detection assembly. The contact detection assembly detects a position of the connector relative to a connection interface. Based on the position of the connector relative to the connection interface, a state of connection between the connector and the connection interface is determined.

The invention is an assembly for checking the functionality of a measuring object, that is a DUT, in a medical implant or at least one part of the medical implant. The assembly comprises a test signal generator, a test module that is connected to the test signal generator. The assembly has a first receiving structure with at least one contact electrode, into which an adapter rigidly connects to the DUT in a releasable manner which is inserted to form least one electrical contact. A control and analysis unit is connected to the test signal generator and to the test module in a wired or wireless manner.

Provided is a test device for roll-to-roll board of flexible circuit boards. The test device comprises a detection probe frame, front and rear ends of the detection probe frame being connected to a sliding frame, and a bottom of the sliding frame being connected to a magnetic plate; wherein the magnetic plate is consisted of a square panel in the middle and four isosceles trapezoidal panels in upright direction; the four isosceles trapezoidal panels is movable and is capable of being rotated towards the square panel; a bottom of the square panel is provided with 4×4 centralized ports, the angle between the centralized port and a vertical line of the panel is 30°; the upper surface of the magnetic plate is provided with four catching splints, the catching splint is movable on the magnetic plate.

According to one embodiment, a method includes: supplying electrical energy to a first path by an inspection circuit with a short circuit between two first terminals through a first probe; and detecting an electrical characteristic on the first path by the inspection circuit. The two first terminals are included in a plurality of second terminals included in a flexible printed circuit board. The flexible printed circuit board includes: an electronic component including the inspection circuit and a plurality of third terminals; the plurality of second terminals; and a plurality of first wired lines connecting the plurality of second terminals and the plurality of third terminals. The first path is formed by: the two first terminals; two second wired lines connected to the two first terminals among the plurality of first wired lines; and two fourth terminals connected to the two second wired lines among the plurality of third terminals.

In the measurement device, electrical characteristics of a component can be measured adequately even if the component size is small. In the measurement device, at least a part of the component holding section is an antistatic section made of an antistatic material. Since the surface resistance of the antistatic section is large, it is possible to measure the electrical characteristics of a component in a state where the component is held by the antistatic section. Therefore, even if the size of the component is small, scattering of the component is prevented and the electrical characteristics can be adequately measured.