The present invention relates to a method for electrical testing of an electrical circuit for defects, all electrical or electronic parts are measured simultaneously, so an electrical image of the electrical circuit is received by a control/evaluation unit, in which an electrical excitation signal of an electrical current or an electrical voltage is applied simultaneously by the control/evaluation unit and a plurality of driver circuits at a plurality of test points of the electrical circuit, which test points may be arranged in any way. The electrical excitation signals applied via the driver circuits differ with regard to their spectral characteristic. The electrical current flowing in the particular test point and the resultant electrical voltage are recorded synchronously with regard to a waveform in relation to an electrical ground potential, and subsequently parameters of the parts and their electrical connections are calculated by the control/evaluation unit.

The disclosed embodiments provide a system that detects unwanted electronic components in a target computing system. During operation, the system obtains target electromagnetic interference (EMI) signals, which were gathered by monitoring EMI signals generated by the target computing system, using an insertable device, wherein when the insertable device is inserted into the target computing system, the insertable device gathers the target EMI signals from the target computing system. Next, the system generates a target EMI fingerprint from the target EMI signals. Finally, the system compares the target EMI fingerprint against a reference EMI fingerprint for the target computing system to determine whether the target computing system contains any unwanted electronic components.

In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.

An apparatus and method for testing a circuit board included in a battery management system. The circuit board includes a first test point connected in common to one end of a first resistor, one end of a first capacitor and one end of a second resistor; a second test point connected in common to the other end of the second resistor and one end of a second capacitor; a third test point connected to the other end of the first resistor; and a fourth test point connected in common to the other end of the first capacitor and the other end of the second capacitor. The apparatus determines an open-circuit fault of at least one of the first capacitor and the second capacitor based on a first diagnosis voltage between the first and fourth test points and a second diagnosis voltage between the second and fourth test points.

A method of inspecting a printed circuit board includes confirming whether all parts of the printed circuit board need to be inspected, if inspecting all parts of the printed circuit board, checking pins and vias belonging to each differential signal line on the printed circuit board, and outputting an inspecting result.

Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

An interconnect circuit testing apparatus including: an electric signal generating circuit for generating an electric signal; a first electrode arranged at a first region of a substrate, wherein the substrate includes an interconnect circuit, an upper surface and a lower surface; a second electrode arranged at a second region of the substrate; and a sensor for detecting an electric field emitted from the first region or the second region when the electric signal is applied to the substrate through the first electrode and the second electrode.

The device for testing a motherboard includes a power adapter, a first DC-DC converter, and a microcontroller. The power adapter converts an AC input voltage to a DC supply voltage. The DC-DC converter converts the DC supply voltage to a DC voltage at a channel coupled to the motherboard, and adjusts a voltage level of the DC voltage in response to a control signal. The DC-DC converter is enabled according to an enable signal. The microcontroller is configured to provide the control signal and the enable signal, and to determine whether a power on/off operation of the motherboard is normal. The microcontroller is configured to perform a test procedure on the motherboard to obtain a workable voltage range of the motherboard. The voltage level of the DC voltage in the test procedure is dynamically adjusted within a predetermined range around a nominal voltage value of the DC voltage.

A method, system and computer readable medium for determination of distance to an electrical fault within a device. A signal generator excites the device with an electrical input signal. The device comprises an open circuited electrical transmission line. A frequency domain analyzer analyzes part of the signal reflected from the device for determination of the locations of resonant frequency of the signal within the device. A computer calculates the distance to the fault within the device, based on the resonant frequency. The distance to the fault is one quarter wavelength distance into the device at the resonant frequency. A frequency sweeper sweeps the frequency of the input signal and repeated calculation of the distance to the fault made at a plurality of resonant frequencies during the frequency sweep confirms the distance to the fault by convergence of the result of the repeated calculations to substantially the same location.

Electrical equipment comprising a first portion and a second portion that is electrically insulated from the first portion, the first portion comprising a frontal component, a diode, a photodiode and a processing module, the second portion comprising a first connector connected to the frontal component while being electrically insulated therefrom, a receiving space being arranged to receive a second connector that is able to be connected to the first connector, the processing module being arranged to deliver a supply current to the light-emitting diode so that the latter produces an emitted light signal, in order to acquire a detection electrical signal produced by the photodiode representative of a light signal received by the photodiode, and in order to detect a presence or absence of the second connector in the receiving space depending on the detection electrical signal.