Patent classifications
G01R31/2815
DYNAMIC INTELLIGENT TEST METHOD AND COMPUTER DEVICE EMPLOYING THE METHOD
A method for dynamic intelligent testing of a target, to be tested according to projects, includes calling up a data distribution model of a project in response to a target being tested by the project, and obtaining a test range corresponding to the project based on the data distribution model. The method further includes obtaining a test value when the target is at a minimum power consumption value by testing the target based on the test range, and updating the data distribution model and the test range of the project based on the test value.
Isolation circuit having test mechanism and test method thereof
The present invention discloses an isolation circuit having test mechanism. An isolation circuit component performs signal transmission when a signal that a control terminal receives has an enabling state and performs signal isolation when the signal has a disabling state. The test circuit includes a multiplexer and a control circuit. Under a shifting operation state in a test mode, the control circuit controls the multiplexer to select an operation input terminal to receive and output an isolation control signal having the enabling state to the control input terminal. Under a capturing operation state in the test mode, the control circuit controls the multiplexer to select a test input terminal to receive and output the test signal to the control input terminal. The control circuit further determines whether the isolation circuit performs signal transmission or signal isolation according to the signals at the data input terminal and the data output terminal.
Memory device architecture coupled to a system-on-chip
The present disclosure relates to an apparatus comprising a non-volatile memory architecture configured to be coupled to a System-on-Chip (SoC) device. The non-volatile memory device coupled to the SoC having a structurally independent structure linked to the SoC includes a plurality of sub arrays forming a matrix of memory cells with associated decoding and sensing circuitry, sense amplifiers coupled to a corresponding sub array, a data buffer comprising a plurality of JTAG cells coupled to outputs of the sense amplifiers; and a scan-chain connecting together the JTAG cells of the data buffer.
Circuits and techniques for assessing aging effects in semiconductor circuits
In some examples, a method of operating a circuit may comprise performing a circuit function under normal conditions, performing the circuit function under aggravated conditions, predicting a potential future problem with the circuit function under the normal conditions based on an output of the circuit function under the aggravated conditions, and outputting a predictive alert based on predicting the potential future problem.
Current shunt with reduced temperature relative to voltage drop
An electronic device includes a structured metallization layer including a plurality of contact pads that are electrically isolated from one another, and a metal clip connected in a current shunt measurement arrangement with a semiconductor device, wherein the metal clip includes first, second and third landing pads, a first bridge span connected between the first and second landing pads, and second bridge span connected between the second and third landing pads, wherein the first, second third landing pads are respectively thermally conductively attached to first, second and third contact pads from the structured metallization layer, and wherein the second mounting pad is electrically floating.
Differential aging monitor circuits and techniques for assessing aging effects in semiconductor circuits
In some examples, this disclosure describes a method of operating a circuit. The method may comprise performing a circuit function under normal operating conditions, wherein performing the circuit function under the normal operating conditions includes performing at least a portion of the circuit functions via a characteristic circuit, performing at least the portion of the circuit function under enhanced stress conditions via a characteristic circuit replica, and predicting a potential future problem with the circuit function under the normal conditions based on an evaluation of operation of the characteristic circuit relative to operation of the characteristic circuit replica.
Method and/or system for testing devices in non-secured environment
Disclosed are methods, systems and devices for implementing built-in self-test (BIST) to be performed by an untrusted party and/or in an unsecure testing environment. In an embodiment, a test access port (TAP) on a device may enable a party to initiate execution of one or more BIST procedures on the device. Additionally, such a TAP may enable loading of encrypted instructions to be executed by one or more processors formed on a device under test.
Memory device architecture coupled to a System-on-Chip
The present disclosure relates to an apparatus comprising a non-volatile memory architecture configured to be coupled to a System-on-Chip (SoC) device. The non-volatile memory device coupled to the SoC having a structurally independent structure linked to the SoC includes a plurality of sub arrays forming a matrix of memory cells with associated decoding and sensing circuitry, sense amplifiers coupled to a corresponding sub array, a data buffer comprising a plurality of JTAG cells coupled to outputs of the sense amplifiers; and a scan-chain connecting together the JTAG cells of the data buffer.
CIRCUIT BOARD AND METHOD AND DEVICE RELATED TO THE SAME
A circuit board and a method for electrical performance detection thereof, a display panel, a method for fabricating a display panel, and a method for driving the display panel are provided. In the electrical performance detection, the signal output terminal is electrically connected to the detection terminal, and detection is performed on the drive signal by the electrical performance detection circuit to determine whether the circuit board is abnormal, achieving the electrical performance detection of the circuit board. In addition, in a process other than the electrical performance detection, the signal output terminal is disconnected from the detection terminal to avoid affecting a normal operation of the circuit board. The electrical performance detection of the circuit board is realized, a defective circuit board is prevented from flowing into a subsequent fabricating procedure, and waste of assembling resources is avoided.
Method of and an arrangement for analyzing manufacturing defects of multi-chip modules made without known good die
The present invention provides a reliable method and arrangement for boundary scan testing and debugging newly manufactured multi-chip modules (MCMs) made to identical design specifications with no Known Good Die therein. Advantageously, a first and a second MCM are temporarily linked in tandem for boundary scan testing through a motherboard and daisy-chaining their internal dice, and interlinking the corresponding boundary scan cells of the identical dice of the first and second MCM to (1) run self-test on individual MCMs and mutual test on the MCMs connected in tandem in order to generate an extended Truth Table that includes responses from an array of combined netlists of the first and second MCMs, and (2) to diagnose mismatched bits in the extended Truth Table using a Boundary Scan Diagnostics software so as to identify defects in the first and second MCMs.