A testing board (i.e., testing fixture) includes a printed circuit board (PCB), an external connection port, and plural coaxial radio frequency (RF) connector sets. The external connection port is located on the printed circuit board. Each of the coaxial RF connector sets includes a top coaxial RF connector and a bottom coaxial RF connector. The top coaxial RF connector and the bottom coaxial RF connector are respectively disposed on a top surface and a bottom surface of the printed circuit board in a coaxial arrangement and electrically connect to the external connection port.

A circuit and a method for reducing interference of power on/off to hardware test. The circuit includes: a power unit, a voltage processing unit, a PSU and a to-be-tested hardware. An input terminal of the voltage processing unit is connected to the power unit, an output terminal of the voltage processing unit is connected to an input terminal of the PSU, and an output terminal of the PSU is connected to the to-be-tested hardware; the power unit is configured to provide an operating voltage; the voltage processing unit is configured to eliminate electric sparks caused by instability of the operating voltage at an instant of power on/off; the PSU is configured to convert a stable operating voltage outputted from the voltage processing unit into a direct current voltage required for the to-be-tested hardware; and the to-be-tested hardware is configured to receive the direct current voltage outputted from the PSU.

Disclosed is a testing device for an automotive controller, which includes a plurality of Device Under Test (DUT) lines for connection to respective DUT lines in the automotive controller, and first and second multiplexers for selecting individual DUT lines. First and second measurement modules are connected to the multiplexers for measuring signal characteristics on the selected DUT lines. An interconnect circuit is operable for selectively connecting stimulation modules to the measurement modules for stimulating electrical signals on the selected DUT lines. A controller is provided to control the switching of the multiplexers and the interconnect circuit and for receiving the measured signal characteristics from the first and second measurement modules for testing the respective DUT lines in the automotive controller. Also disclosed are methods and software for controlling testing devices.

A light emitting display apparatus includes a first substrate including pixels and signal lines arranged in a first direction and a second substrate disposed on a rear surface of the first substrate, wherein a routing portion including routing lines is provided on a first lateral surface of the first substrate and a second lateral surface of the second substrate. In the first substrate, a first pad portion adjacent to the first lateral surface includes first pads connected to the signal lines and the routing lines and first test pads for determining the occurrence or not of defects of the routing lines. In the second substrate, a second pad portion adjacent to the second lateral surface includes second pads connected to the routing lines and second test pads connected to the first test pads.

A test fixture for PCB components is described herein. The test fixture comprises a shim with an aperture configured to direct RF energy from a component of a PCB, via an end of the PCB, and to a top clamp of the test fixture. The end of the PCB may correspond to a cut line of a destructive test. The test fixture also comprises the top clamp with a test port and a taper configured to direct the RF energy from the aperture to the test port. The test fixture also comprises a bottom clamp attached to the top clamp to retain the PCB between the top and bottom clamps for testing. The test fixture allows for quick mounting of the PCB and testing of the component without modifying a design of the PCB or requiring specific drilling of the PCB.

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

A method of testing a semiconductor device having a DC line configured to carry either a DC signal or a DC voltage and a circuit electrically connected to the DC line includes: during a first part of a test sequence, enabling a switch device so as to electrically connect a capacitor to the DC line via the switch device and applying a test signal to the circuit while the capacitor is electrically connected to the DC line; and during a second part of the test sequence, disabling the switch device so as to electrically disconnect the capacitor from the DC line via the switch device, injecting an AC signal onto the DC line after the capacitor is electrically disconnected from the DC line, and measuring a response of the circuit to the AC signal.

An embodiment of the present invention is an automated test equipment (ATE) for testing a device under test (DUT) which is connected to the ATE via a load board. The ATE comprises a stimulus module, a measurement module, a loopback, a first switch, a second switch, and a load board interface. The load board interface comprises a first radio frequency port and a second radio frequency port. The first and second radio frequency ports are configured to be coupled to the respective ports of the load board. The first switch is configured to couple the first radio frequency port to the stimulus module in a first switching state of the first switch and the second switch is configured to couple the second radio frequency port to the measurement module in a first switching state of the second switch. Further, the first switch is configured to couple the first radio frequency port to a first end of the loopback in a second switching state of the first switch and the second switch is configured to couple the second radio frequency port to a second end of the loopback in a second switching state of the second switch. When the first and second switches are in their respective second switching state, a loopback signal path is formed between the first and second radio frequency ports.

In some examples, a device includes a power structure and a sensing structure that is electrically isolated from the power structure. The device also includes processing circuitry configured to determine whether the sensing structure includes a prognostic health indicator, wherein the prognostic health indicator is indicative of a health of the power structure.

An active load circuit that includes a diode bridge having first through fourth nodes, wherein a voltage buffer is connected with the first node, a source current mirror is connected with the second node, the third node is configured for connection to a device under test (DUT), and a sink current mirror is connected with the fourth node. A first current mirror is connected with the source current mirror, and a second current mirror is connected with the sink current mirror. A first differential pair is connected with the first current mirror and includes an input connected with the DUT and a second input connected with the input voltage. A second differential pair is connected with the second current mirror and includes a first input connected with the DUT and a second input connected with the input voltage.