A method for performing predictive maintenance of an amplifier module is described. At least one parameter of at least one amplifier module is acquired via a measurement data acquisition unit. The at least one parameter acquired is analyzed via a measurement data analyzing unit so as to predict the probability and/or time of default of the at least one amplifier module. Further, a system is described.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

An aspect relates to an apparatus including a set of one or more receivers; a first replica circuit being a substantial replica of at least a portion of one of the set of one or more receivers; a first control circuit generates an output signal selectively coupled to an input of the first replica circuit; a second replica circuit being a substantial replica of at least a portion of one of the set of one or more receivers; a comparator including a first input coupled to a first output of the first replica circuit, a second input coupled to a second output of the second replica circuit, and an output; and a second control circuit including an input coupled to the output of the comparator, and an output coupled to the first replica circuit and to the set of one or more receivers.

A test card and a test display adapter are disclosed. The test card includes an assembling plate and an electrical heat source. The electrical heat source is provided on the assembling plate. The electrical heat source includes a first heat transfer plate, a second heat transfer plate and at least one heat source element. The first heat transfer plate is stacked on the assembling plate, and the second heat transfer plate is laminated over the first heat transfer plate, with the heat source element being sandwiched between the first and second heat transfer plates. The test card and the test display adapter have a wide variety of advantages including very low cost, easy material availability, a short wait time, easy manufacturability, a long service life, easy modifiability and good interoperability.

The present invention discloses an in-situ monitoring method and apparatus for a power electronic device explosion. A power electronic device is excited to produce an explosion failure by using a fault excitation module. An electrical signal of the power electronic device is monitored in real time by using an electrical signal monitoring module. Gas information of a test cavity is monitored in real time by using a gas monitoring module. External pictures of the power electronic device are captured by using a high-speed image capturing module. Internal pictures of the power electronic device are captured by using a high-speed X-ray imaging module. Each module in the apparatus is triggered to work according to a predetermined time sequence and time interval by using a time sequence control module. The entire apparatus is controlled and data is acquired, stored, and displayed by using a main control module.

Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

A device for predicting a life expectancy of a fuse for a battery of an electric vehicle may include a sensor configured to generate and output current information about current flowing in the fuse, a processor, and a memory connected to the processor and configured to store a preset lookup table, the memory storing program instructions which are executable by the processor to generate fuse-life expectancy information corresponding to the fuse based on the lookup table and time corresponding to an excess when the current information exceeds a preset threshold value.

Systems and methods for semiconductor design evaluation. IC layout information of a circuit design is received, and the circuit design is decomposed into smaller circuit pieces. Each circuit piece has IC layout information and a netlist. For each circuit piece, a set of strike models is selected based on the layout information and the net-list of the circuit piece and received radiation environment information. Each strike model has circuit components with voltage values corresponding to a respective particle strike. For each selected strike model of a circuit piece: a radiation susceptibility metric is determined by comparing functional results of simulation of the of the strike model with functional results of simulation of the circuit piece. For each circuit piece, a radiation susceptibility metric is determined based on the radiation susceptibility metrics generated for each selected strike model of the circuit piece.

A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.