A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

An inspection apparatus configured to inspect a target object includes a placing device configured to place the target object thereon; a heater provided in the placing device and configured to adjust a temperature of the placing device; and a position adjusting mechanism configured to hold the placing device on which the target object is placed, and configured to perform a position adjustment between the target object placed on the placing device and a terminal to be brought into contact with the target object when an inspection of an electrical characteristic is performed. The placing device is configured to be separated from the position adjusting mechanism when the inspection of the electrical characteristic is performed. A heat sink having prominences and depressions is provided at a portion of the placing device except a holding target portion thereof which is to be held by the position adjusting mechanism.

A display panel and a manufacturing method thereof are provided. The display panel includes a substrate, and a first connecting line, a second connecting line, a first GOA circuit, and a second GOA circuit disposed on the substrate. The first GOA circuit is disposed opposite to the second GOA circuit, and a first single-sided driving area and a second single-sided driving area are sequentially disposed between the first GOA circuit and the second GOA circuit. The first connecting line is disposed in the first single-sided driving area and connected to an input terminal of the first GOA circuit, and the second connecting line is disposed in the second single-sided driving area and connected to an input terminal of the second GOA circuit. The present disclosure can prevent screen tearing which is caused by single-sided driving when performing an aging test, and improve a yield of the display panel.

A device for testing performance of main boards of electronic devices includes a housing, two bases, a control device, a humidifier, a heating device, and a refrigerating device. A cavity in the housing comprises separated first and second portions. The heating device is interconnected with the first portion to create a predefined high temperature environment and the refrigerating device is interconnected with the second portion to create a predefined low temperature environment. The humidifier is interconnected with the first portion and the second portion, and configured to create predefined degrees of humidity respectively in the first portion and the second portion. The bases are inside the first portion and the second portion, and electrically connected to the control device.

A self-heating effect apparatus includes a memory and a processor. The processor is coupled to the memory and configured to process a self-heating effect model for characterizing a heat flow network of devices. The devices include a device under test and one or more adjacent devices surrounding the device under test. The self-heating effect model includes a reference thermal resistance and a reference thermal capacity; a thermal temperature feedback model used to acquire a thermal level of the device under test; a thermal resistance modification model used to acquire a modified thermal resistance of the device under test according to the thermal level of the device under test and the reference thermal resistance; and a thermal capacity modification model used to acquire a modified thermal capacity of the device under test according to the thermal level of the device under test and the reference thermal capacity.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.

A lifetime estimation system for estimating a lifetime of a heating source is provided in an apparatus for heating a target object using the heating source and performing a feedback control of a target object temperature using a temperature controller based on a temperature measurement value of the target object measured by a temperature measuring device. The temperature controller controls a power supplied to the heating source and performs a temperature control using a state space model to perform the feedback control of the temperature of the target object. The lifetime estimation system includes a temperature monitor unit that monitors the temperature measurement value of the target object, a hunting amount detection unit that detects a hunting amount in a stable region of the monitored temperature of the target object, and a lifetime estimation unit that estimates a lifetime of the heating source from the detected hunting amount.

A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.

A method of screening a lot of capacitors is provided. The method includes measuring a first leakage current of each individual capacitor in a first set of capacitors and calculating a first mean leakage current; removing each of the individual capacitors having a measured first leakage current equal to or above a first predetermined value, forming a second set of capacitors; subjecting the second set of capacitors to a burn in treatment; measuring a second leakage current for each of the individual capacitors in the second set and calculating a second mean leakage current; comparing the second leakage current for each of the individual capacitors to the first leakage current for each of the individual capacitors; and removing each of the individual capacitors having a second leakage current equal to or above a second predetermined value and/or having a second leakage current that does not change by a specified amount compared to the first leakage current for each of the individual capacitors.

A test board and a test apparatus having the same are disclosed. The test board includes a base plate including a connector and a plurality of mounting areas in a matrix shape having a mounting row in a first direction and a mounting column in a second direction, a plurality of test units arranged on the mounting areas of the base plate and a test object is mounted in each of the mounting areas, and a fluid supplier disposed on the base plate and supplying a test fluid to each of the test units having a test temperature and a supplementary fluid to the test object to reduce a temperature difference between an actual temperature of the test object and the test temperature such that the actual temperature of the test objects is substantially below the test temperature.