A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

A system includes a platform and a contactor. The platform has a side configured to support a frame with a carrier structure and electronic devices each having first and second sides and a terminal, the first side positioned on the carrier structure, and the terminal exposed in a first portion of the second side. The contactor has first and second sides, a contact and a heater. The contact is exposed on the first side of the contactor to contact the terminal in a first portion of the second side of a selected one of the electronic devices, and the heater is exposed on the first side of the contactor to apply heat to a second portion of the second side of the selected one of the electronic devices.

An electronic component handling apparatus handles a DUT and includes: an acquiring device that acquires current three-dimensional shape data of a DUT container having a plurality of accommodating portions each capable of accommodating the DUT; and a computer device that: calculates a first correction amount from the current three-dimensional shape data and corrects the current three-dimensional shape data based on the first correction amount; extracts, from the corrected three-dimensional shape data, at least one of a height and a slope of each of predetermined regions of the DUT container; and determines an accommodation state of the DUT based on an extraction result. The first correction amount represents at least one of a movement amount and a rotation amount in a planar direction of the current three-dimensional shape data with respect to an initial state of the DUT container set in advance.

Systems, apparatuses, and methods for efficiently performing active thermal control during device testing are disclosed. A device testing system includes a device under test, a thermal structure on top of the device under test, and a controller configured to determine when to apply and remove thermal energy to the device under test through the thermal structure. The thermal structure includes a thermal transfer block that transfers thermal energy to and from the device under test below the thermal transfer block. The thermal structure also includes a coolant block above the thermal transfer block that removes thermal energy from the thermal transfer block. There is no heating element between the coolant block and the thermal transfer block. Rather, the thermal structure includes a heating element in a wall of the thermal transfer block. Therefore, an unobstructed thermal path exists from the device under test to the coolant block.

A storage unit is used for storing a plurality of interface units. A disposition system then automatically manages interface units. A carrier is provided for accommodating an interface unit. The interface unit is configured for testing semiconductor elements in corresponding test devices. The storage unit is designed for storing a plurality of interface units, the storage unit having a plurality of compartments, each for accommodating one carrier, and each such carrier being designed to accommodate one interface unit. The storage unit comprises at least one alignment element for positionally accurate coupling of a handling device.

A touch testing apparatus includes: a pogo pad area including input and output test pogo pads respectively connected to input and output test pads disposed in a pad area of a touch detection module; a test touch driver circuit configured to detect compression deviations between the input test pad and the input test pogo pad and between the output test pad and the output test pogo pad, and to correct touch data of the touch detection module based on the detected compression deviations; and a test board on which the test touch driver circuit is mounted, wherein the test board is configured to electrically connect the test touch driver circuit with the input and output test pogo pads.

A semiconductor device includes a semiconductor substrate having a main surface over which a plurality of die pads and at least one alignment pad for optical process control for semiconductor wafer probing are arranged. The alignment pad has a hardness smaller than a hardness of the plurality of die pads.

A test apparatus and an automatic test equipment having the same are disclosed. The test apparatus includes a test head having a test area, a socket board combined to the test area of the test, the socket board including a socket body and an active device attached on a first surface of the socket body, the active device configured to operate a semiconductor package, and a heat exchanger arranged on an upper portion of the test head, the heat exchanger being in contact with the socket board.

Disclosed herein are apparatuses and methods for mitigating sticking of units-under-test (UUTs). For example, in some embodiments, a probe card may include a probe landing pad, a guide plate having a hole therein, and a pushing mechanism. The pushing mechanism may include a pusher needle and a pusher needle support, the pusher needle support may be between the probe landing pad and the guide plate, and the pusher needle support may be controllable to cause the pusher needle to extend and retract through the hole in the guide plate.