An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.

Disclosed are a substrate inspection apparatus and a method for displaying a component in a three-dimensional inspection of a substrate. The substrate inspection apparatus measures a substrate or an inspection target region of interest of the substrate and displays an image of components positioned within the measured region on a display unit. The image of the components displayed on the display unit may be displayed in a predetermined reference direction. The difference between the reference direction and a direction in which the actual component is disposed on the substrate is displayed in the form of a numerical value or a figure. Alternatively, the image of the component in the reference direction and the image of the actually disposed component are simultaneously displayed on a screen, and a user may convert a display method of the image by using a toggle button.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

A test apparatus includes an output configured to be coupled to a sense input of an arc quenching device control circuit of an arc quenching system, a user interface, and a control circuit configured to generate a simulated sense signal at the output in response to an input at the user interface, the simulated sense signal representing a physical state associated with a fault condition of a bus coupled to the arc quenching system. The simulated sense signal may be configured to cause the arc quenching device control circuit to trigger an arc quenching device of the arc quenching system. The physical state may include, for example, a voltage condition, a current condition, a temperature, a pressure or a light intensity. In some embodiments, the simulated sense signal may include a current indicative of a current passing through a bus to which the arc quenching system is connected.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A feedback control system for RFID assembly production. The control system can include a measurement system and a control system. The measurement system may take measurements of one or more electrical properties of an RFID chip assembly, for example an RFID strap or RFID antenna. The measurement system may then communicate to the control system to adjust one or more parameters affecting the electrical properties. Once the desired set of electrical properties is achieved, the chip assembly may be cured. The feedback control system may be implemented dynamically, either for precision assembly of individual chip assemblies or in batch for controlling the average properties of assemblies on a rolling production line. The feedback control system can also be implemented in a step-wise fashion and be used to collect data and iteratively self-improve.

A radio frequency conduction test method and a test system are provided. The test method includes: moving a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe and then transmitted to a radio frequency test instrument for a radio frequency conduction test, where the test signal in the radio frequency test probe is transmitted to the radio frequency test instrument via an impedance conversion apparatus and a directional coupler, a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument.

A radio frequency conduction test method and a test system are provided. The test method includes: moving a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe and then transmitted to a radio frequency test instrument for a radio frequency conduction test, where the test signal in the radio frequency test probe is transmitted to the radio frequency test instrument via an impedance conversion apparatus and a directional coupler, a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument.

A precise optical technique for measuring electronic transport properties in semiconductors is disclosed. The sensitivity of the technique to electronic transport properties follows from a simple analytic expression for the Z dependence of a photo-modulated reflectance signal in terms of the (complex) carrier diffusion length. The sensitivity of the technique to electronic transport properties also enables a trained neural network to predict electronic transport properties directly from Z-scan photo-modulated reflectance data. Synthetic data and/or physical constraints may be derived from the analytical expression and incorporated into a machine learning algorithm. Moreover, electronic transport properties as determined or predicted may be used to enable machine learning based control of semiconductor process tools and/or manufacturing processes, including via advanced reinforcement learning algorithms.