A method and an apparatus for generating x-ray inspection image of an electronic circuit board are disclosed. The method includes: respectively generating, according to data files of the electronic circuit board and parameters of an X-ray machine, analog images of both faces of the electronic circuit board; subjecting the electronic circuit board to X-ray imaging to generate a real image of the electronic circuit board, the real image comprising real image elements on both faces of the electronic circuit board; identifying, according to the analog images of both faces, from the real image an interference image element that needs to be filtered from the real image for generating a real image of a detected object; and filtering the interference image element from the real image to generate the real image of the detected object.

A directional pulse injection system and method are described for injecting a pulse into a microelectronic system for electrostatic test. One example has a transformer coupled to a pulse source through a transmission line and to a conductive trace of a test board to apply the electrical pulse to the trace as a test pulse. The test board is connected to a microelectronic device under test. This example also has a cancellation pulse transmission line coupled to the pulse source and a cancellation pulse contact coupled to the pulse source through the cancellation pulse transmission line and to the trace on a side of the trace opposite the transformer to receive a cancellation signal from the pulse source and to couple the cancellation signal to the trace to cancel a portion of the test pulse.

Disclosed are a substrate inspection apparatus and a method for displaying a component in a three-dimensional inspection of a substrate. The substrate inspection apparatus measures a substrate or an inspection target region of interest of the substrate and displays an image of components positioned within the measured region on a display unit. The image of the components displayed on the display unit may be displayed in a predetermined reference direction. The difference between the reference direction and a direction in which the actual component is disposed on the substrate is displayed in the form of a numerical value or a figure. Alternatively, the image of the component in the reference direction and the image of the actually disposed component are simultaneously displayed on a screen, and a user may convert a display method of the image by using a toggle button.

The present invention relates to a graphic user interface for a 3D board inspection apparatus. The graphic user interface includes an actual measurement image display area in which a 3D actual measurement image of an inspection target is displayed based on 3D actual measurement data for the inspection target on a board, and a dimension setup display area in which a dimension of the inspection target in CAD data, a dimension of the inspection target in the 3D actual measurement data and a recommend dimension of the inspection target based on the 3D actual measurement data are displayed. A first contour line of the inspection target based on the dimension of the inspection target in the CAD data and a second contour line of the inspection target based on the 3D actual measurement data is displayed with overlapping the 3D actual measurement image of the inspection target in the actual measurement image display area.

The present invention relates to a graphic user interface for a 3D board inspection apparatus. The graphic user interface includes an actual measurement image display area in which a 3D actual measurement image of an inspection target is displayed based on 3D actual measurement data for the inspection target on a board, and a dimension setup display area in which a dimension of the inspection target in CAD data, a dimension of the inspection target in the 3D actual measurement data and a recommend dimension of the inspection target based on the 3D actual measurement data are displayed. A first contour line of the inspection target based on the dimension of the inspection target in the CAD data and a second contour line of the inspection target based on the 3D actual measurement data is displayed with overlapping the 3D actual measurement image of the inspection target in the actual measurement image display area.

A precise optical technique for measuring electronic transport properties in semiconductors is disclosed. Using tightly focused laser beams in a photo-modulated reflectance system, the modulated reflectance signal is measured as a function of the longitudinal (Z) displacement of the sample from focus. The modulated component of the reflected probe beam is a Gaussian beam with its profile determined by the focal parameters and the complex diffusion length. The reflected probe beam is collected and input to the detector, thereby integrating over the radial profile of the beam. This results in a simple analytic expression for the Z dependence of the signal in terms of the complex diffusion length. Best fit values for the diffusion length and recombination lifetime are obtained via a nonlinear regression analysis. The output diffusion lengths and recombination lifetimes and their estimated uncertainties may then be used to evaluate various transport properties and their associated uncertainties.

A precise optical technique for measuring electronic transport properties in semiconductors is disclosed. Using tightly focused laser beams in a photo-modulated reflectance system, the modulated reflectance signal is measured as a function of the longitudinal (Z) displacement of the sample from focus. The modulated component of the reflected probe beam is a Gaussian beam with its profile determined by the focal parameters and the complex diffusion length. The reflected probe beam is collected and input to the detector, thereby integrating over the radial profile of the beam. This results in a simple analytic expression for the Z dependence of the signal in terms of the complex diffusion length. Best fit values for the diffusion length and recombination lifetime are obtained via a nonlinear regression analysis. The output diffusion lengths and recombination lifetimes and their estimated uncertainties may then be used to evaluate various transport properties and their associated uncertainties.

Disclosed are a flexible printed circuit and a detecting device, a detecting method and a display device thereof. The flexible printed circuit comprises a body and an interface structure that is connected with the body, wherein the interface structure is provided with a plurality of mark lines dividing the interface structure into a plurality of interfaces with the same structure. When a front end interface of the flexible printed circuit of the disclosure is damaged, the front end interface can be removed along the mark line, and then an exposed rear end interface can be used successively, thus preventing a situation where the flexible printed circuit cannot be used because the only interface is damaged, thereby extending the life span of the flexible printed circuit, reducing productivity loss due to frequent replacements of the flexible printed circuit and reducing production cost.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.