An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

A display panel, a display device and an inspection method are provided. The display panel comprises a plurality of scanning lines, a plurality of data lines including a plurality of first-type data lines and a plurality of second-type data lines, and a plurality of sub-pixels arranged in an array. The second-type data lines are closer to a center of the display panel than the first-type data lines along a first direction. The first-type data line is connected to at least one second-type data line, and the connected first-type data line and the at least one second-type data line are connected to the sub-pixels having a same color in a same sub-pixel row, respectively. The first-type data line receives a voltage signal from an external circuit, and the at least one second-type data line receives the voltage signal from the connected first-type data line.

An inspection method comprises receiving light emanating from a first surface of a wafer substantially along a first axis for obtaining a first image of the first surface therefrom, the wafer having a crack formed therein and the first image containing at least one portion of the crack. The inspection method also comprises receiving light emanating from the first surface of the wafer substantially along a second axis for obtaining a second image of the first surface therefrom, the second image containing at least one second portion of the crack, the first surface extending substantially parallel a plane, and the orthographic projection of the first axis on the plane being substantially perpendicular the orthographic projection of the second axis on the plane. The inspection method further comprises constructing a third image from the at least one first portion of the crack and the least one second portion of the crack of the first and second images respectively. More specifically, the third image is substantially processable for inspecting the crack in the wafer.

The present invention relates to a system, a measurement probe and a method for measuring an electrical property of an electrical circuit, comprising measuring the electrical property by means of a measurement probe connected to the electrical circuit, converting the measured electrical property of the electrical circuit to an optical signal. The method further comprises sending the optical signal, and receiving the optical signal by means of an image sensor configured to record images comprising the measurement probe that transmits the optical signal. The method further comprises processing the recorded images in order to decode the measurement data from the received optical signal.

A printed circuit board checking system includes a movement mechanism, an image capturing unit, an image analyzing unit, a storage unit and a determining unit. The image capturing unit moves in response to motion of the movement mechanism, relative to a printed circuit board moves in X axis, Y axis and Z axis and continuously captures a number of images of the printed circuit board. The image analyzing unit analyzes the number of images to obtain an arrangement information of elements of the printed circuit board. The storage unit stores a standard arrangement information of elements of the printed circuit board. The determining unit determines which element does not meet requirement according to the analyzed arrangement information of the element of the printed circuit board and the standard arrangement information of the element of the printed circuit board.

An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.

A radio frequency conduction test method and a test system are provided. The test method includes: moving a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe and then transmitted to a radio frequency test instrument for a radio frequency conduction test, where the test signal in the radio frequency test probe is transmitted to the radio frequency test instrument via an impedance conversion apparatus and a directional coupler, a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument.

A radio frequency conduction test method and a test system are provided. The test method includes: moving a radio frequency test probe to a first pad of a board so as to allow a test signal on the first pad to be transmitted to the radio frequency test probe and then transmitted to a radio frequency test instrument for a radio frequency conduction test, where the test signal in the radio frequency test probe is transmitted to the radio frequency test instrument via an impedance conversion apparatus and a directional coupler, a straight-through output port of the directional coupler is connected to a first measurement port of the radio frequency test instrument, and a coupling output port of the directional coupler is connected to a second measurement port of the radio frequency test instrument.

Methods for measuring crosstalk in an electronic circuit having multiple ports comprises determining two ports of interest of the electronic circuit, in which crosstalk will be measured between. Furthermore, the method includes determining one or more ports of the electronic circuit to be terminated, independent from the ports of interest, so that signals of these ports do not interfere with measuring crosstalk between the two ports of interest. To terminate the ports determined to be terminated, a piece of absorber sheet is used to cover the ports determined to be terminated. Pressure is applied to the piece of absorber sheet such that the piece of absorber sheet makes a good contact and absorbs signals traveling into the ports determined to be terminated, thereby terminating the ports determined to be terminated so that crosstalk between the two ports of interest may be effectively measured.