This disclosure describes a reduced pin bus that can be used on integrated circuits or embedded cores within integrated circuits. The bus may be used for serial access to circuits where the availability of pins on ICs or terminals on cores is limited. The bus may be used for a variety of serial communication operations such as, but not limited to, serial communication related test, emulation, debug, and/or trace operations of an IC or core design. Other aspects of the disclosure include the use of reduced pin buses for emulation, debug, and trace operations and for functional operations.

A device for generating waveforms includes a machine learning system configured to associate waveforms from a device under test to parameters, a user interface configured to allow a user to provide one or more user inputs, and one or more processors configured to execute code that causes the one or more processors to receive one or more inputs through the user interface that include one or more parameters, apply the machine learning system to the received one or more parameters, produce, by the machine learning system, a waveform based on the one or more parameters, and output the produced waveform. Methods of generating waveforms are also presented.

The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.

A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.

An integrated circuit, IC, comprising one or more DC blocking modules connected to a respective input/output, IO, pin of the IC, each DC blocking module comprising: a capacitor having a first terminal connected to the respective IO pin and a second terminal connected to a node of the circuitry of the IC; and an electrostatic discharge, ESD, protection circuit connected in parallel to the capacitor, the ESD protection circuit comprising: a conduction path connected between the first terminal of the capacitor and the second terminal of the capacitor; and a control terminal configured to receive a control signal to switch the ESD protection circuit between: an operational mode in which the conduction path is in a non-conducting state and provides ESD protection to the capacitor; and a test mode in which the conduction path is in a conducting state and short circuits the capacitor.

A reconfigurable JTAG includes, in part, a core logic, a boundary scan chain cell, one or more reconfigurable blocks (RBs), and a reconfigurable block (RB) programming module. The RBs may include, in part, one or more reconfigurable boundary scan chain blocks (RBB) adapted to couple the boundary scan chain cell to the core logic and to input/output (I/O) ports of the reconfigurable JTAG. The RBs may also include, in part, one or more additional reconfigurable logic (ARL) blocks to provide enhanced logic for locking operations. The RB programmable module may communicate with a memory storing data for configuring the RBBs and ARLs. The RB programming module may configure the RBBs and ARLs based at least in part on the data stored in the memory to disable access to the I/O ports of the JTAG. The RB programming module may configure the RBBs to encrypt the I/O ports in accordance with a cipher algorithm. The RB programming module may also configure the RBBs and ARLs to compare a counter's count to a predefined time and lock the I/O ports after an expiration of the predefined time.

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, and a die module coupled to the package substrate. In an embodiment, the die module comprises a die and a chiplet coupled to the die. In an embodiment, the chiplet is coupled to the die with a hybrid bonding interconnect architecture.

A test board for testing a memory signal includes a first surface and a second surface. The first surface of the test board comprises a convex region and a non-convex region. The convex region is provided with a first connection area connectable to a main board, and a level at which the convex region is located is higher than a level at which the non-convex region is located by a preset value. The second surface of the test board includes a test area and a second connection area connectable to a memory chip. The test board is provided with a first connection harness for connecting the test area to the first connection area and a second connection harness for connecting the test area to the second connection area, to enable the memory signal of the memory chip to be tested based on the test area.

A system and method for jitter injection is provided. The system may include a serializer-deserializer (SerDes) circuit. In some examples, the serializer-deserializer (SerDes) circuit have a pre-emphasis circuit and a post emphasis circuit. The system may also include a controller, which may be used to apply specific and varying amounts of pre-emphasis and post-emphasis. The system may also include a jitter injector. In some examples, the jitter injector may be used to inject jitter into the serializer-deserializer (SerDes) circuit based on the applied pre-emphasis and post-emphasis.

A combinational circuit block has input pins configured to receive input digital signals and output pins configured to provide output digital signals as a function of the input digital signals received. A test input pin receives a test input signal. A test output pin provides a test output signal as a function of the test input signal received. A set of scan registers are selectively coupled to either the combinational circuit block or to one another so as to form a scan chain of scan registers serially coupled between the test input pin and the test output pin. The scan registers in the set of scan registers are clocked by a clock signal. At least one input register is coupled between the test input pin and a first scan register of the scan chain. The at least one input register is clocked by an inverted replica of the clock signal.