A semiconductor wafer includes a semiconductor chip that includes a photonic device. The semiconductor chip includes an optical fiber attachment region in which an optical fiber alignment structure is to be fabricated. The optical fiber alignment structure is not yet fabricated in the optical fiber attachment region. The semiconductor chip includes an in-plane fiber-to-chip optical coupler positioned at an edge of the optical fiber attachment region. The in-plane fiber-to-chip optical coupler is optically connected to the photonic device. A sacrificial optical structure is optically coupled to the in-plane fiber-to-chip optical coupler. The sacrificial optical structure includes an out-of-plane optical coupler configured to receive input light from a light source external to the semiconductor chip. At least a portion of the sacrificial optical structure extends through the optical fiber attachment region.

A non-transitory computer-readable recording medium stores an analysis program for causing a computer to execute a process including: reading circuit data; trying to generate test data for a delay fault to be targeted; analyzing whether an underkill is caused when the targeted delay fault results in a redundant fault; and presenting circuit modification locations to avoid the underkill, based on an analysis result, when the underkill is caused.

A scan chain architecture with lowered power consumption comprises a multiplexer selecting between a functional input and a test input. The output of the multiplexer is coupled to a low threshold voltage latch and, in test mode, to a standard threshold voltage latch. The low threshold voltage latch and standard threshold voltage latch are configured to store data when a clock input falls, using a master latch functional clock M_F_CLK, master latch test clock M_T_CLK, slave latch functional clock S_F_CLK, and slave latch test clock S_T_CLK. The slave latch has lower power consumption than the master latch.

An integrated circuit includes a semiconductor die having conductive pads and an electronic component with a first terminal coupled to a third conductive pad and a second terminal coupled to a fourth conductive pad. A resistor has a first terminal coupled to the fourth conductive pad and a second terminal coupled to the fifth conductive pad, and a first transistor has a first terminal coupled to the first conductive pad, a second terminal coupled to the fifth conductive pad, and a control terminal. A second transistor has a first terminal coupled to the first transistor, a second terminal coupled to the third conductive pad, and a control terminal. A pulse generator has an input coupled to the second conductive pad and an output coupled to the control terminal of the second transistor.

High-speed flipflop circuits are disclosed. The flipflop circuit may latch a data input signal or a scan input signal using a first signal, a second signal, a third signal, and a fourth signal generated inside the flipflop circuit, and may output an output signal and an inverted output signal. The flipflop circuit includes a first signal generation circuit configured to generate the first signal; a second signal generation circuit configured to generate the second signal; a third signal generation circuit configured to receive the second signal and generate the third signal; and an output circuit configured to receive the clock signal and the second signal, and output an output signal and an inverted output signal.

An apparatus has a collection of ring oscillators. An instruction register block is configured to sequentially address and activate each ring oscillator in the collection of ring oscillators. A multiplexer with input lines is connected to each ring oscillator in the collection of ring oscillators and an output line. A pulse counter is connected to the output line of the multiplexer to count the number of oscillations of a selected ring oscillator within a selected time period to form a multiple bit frequency count output signal. A data shift register receives the multiple bit frequency count output signal and produces a serial frequency count output signal.

The invention relates to a method, an apparatus and a non-transitory computer-readable storage medium for debugging a solid-state disk (SSD) device. The method is performed by a processing unit of a single-board personal computer (PC) when loading and executing a function of a runtime library, to include: receiving a request to drive a General-Purpose Input/Output (GPIO) interface (I/F), which includes a parameter required for completing a Joint Test Action Group (JTAG) command; issuing a first hardware instruction to the GPIO I/F to set a register corresponding to a GPIO test data input (TDI) pin according to the parameter carried in the request for emulating to issue the JTAG command to a solid-state disk (SSD) device, wherein the single-board PC is coupled to the SSD device through the GPIO I/F; issuing a second hardware instruction to the GPIO I/F to read a value of the register corresponding to the GPIO TDI pin; and replying with a completion message in response to the request.

The invention relates to an apparatus and a system for debugging a solid-state disk (SSD) device. The apparatus includes a Joint Test Action Group (JTAG) add-on board; and a Raspberry Pi. The Raspberry Pi includes a General-Purpose Input/Output (GPIO) interface (I/F), coupled to the JTAG add-on board; and a processing unit, coupled to the GPIO I/F. The processing unit is arranged operably to: simulate to issue a plurality of JTAG command through the GPIO I/F to the SSD device for dumping data generated by the SSD device during operation from the SSD device.

A flip-flop circuit includes a clock generator configured to generate first and second clock signals having different phases relative to each other, and a master-slave latch circuit including master and slave latches. The master latch includes a scan path configured to output a scan path signal in response to a scan enable signal and a scan input signal, and a data path configured to output a first latch signal in response to a data signal and the scan path signal. A feedback path is provided, which includes a tri-state inverter responsive to the first and second clock signals. The tri-state inverter has an input terminal connected to an output terminal of the data path and an output terminal connected to a node of the scan path.

An Information Handling System (IHS) includes multiple hardware devices, and a baseboard Management Controller (BMC) in communication with the plurality of hardware devices. The BMC includes a first processor configured to execute a custom BMC firmware stack, and a second processor including executable instructions for receiving a request to perform a test on the first processor in which the request is received through a secure communication session established with a remote IHS. The instructions further perform the acts of controlling the first processor to perform the test according to the request, the first processor generating test results associated with the test, and transmitting the test results to the remote IHS through the secure communication session.