A built-in self-test circuit includes a command storage unit that stores commands inputted from an external device, an input/output control unit that controls the command storage unit to sequentially store the commands and sequentially output stored commands as internal commands in a test operation, and a command decoder unit that decodes the internal commands outputted from the command storage unit and outputs a test command.

A built-in self-test circuit includes a command storage unit that stores commands inputted from an external device, an input/output control unit that controls the command storage unit to sequentially store the commands and sequentially output stored commands as internal commands in a test operation, and a command decoder unit that decodes the internal commands outputted from the command storage unit and outputs a test command.

On-chip field testing methods and apparatus are disclosed. Example on-chip testers disclosed herein include a decoder having a test data input and a test stimuli interface. Disclosed example on-chip testers also include a multiplexer having a first multiplexer interface coupled to the test stimuli interface, a second multiplexer interface coupled to an automatic test equipment interface, a third multiplexer interface coupled to a design-for-testing subsystem interface and an interface selection input. Disclosed example on-chip testers further include a memory having a memory interface coupled to the test data input.

On-chip field testing methods and apparatus are disclosed. Example on-chip testers disclosed herein include a decoder having a test data input and a test stimuli interface. Disclosed example on-chip testers also include a multiplexer having a first multiplexer interface coupled to the test stimuli interface, a second multiplexer interface coupled to an automatic test equipment interface, a third multiplexer interface coupled to a design-for-testing subsystem interface and an interface selection input. Disclosed example on-chip testers further include a memory having a memory interface coupled to the test data input.

Embodiments are directed to a computer implemented method and system for the testing, characterization and diagnostics of integrated circuits. A system might include a device under test, such as an integrated circuit, that includes an adaptive microcontroller. The method includes loading a testing program for execution by the adaptive microcontroller, causing the microcontroller to execute the testing program. Once results from the testing program are received, the testing program can be adaptively modified based on the results. The modified testing program can be run again. The testing program can modify parameters of the integrated circuit that are not externally accessible. Other embodiments are also disclosed.

An integrated circuit disclosed here includes a first plurality of cell rows, a second plurality of cell rows, first and second clock inverters, and a plurality of flip-flops. The second plurality of cell rows are arranged abutting the first plurality of cell rows. A first number of fins in the first plurality of cell rows is different from a second number of fins in the second plurality of cell rows. The first and second clock inverters are arranged in the second plurality of cell rows. The plurality of flip-flops are arranged in the first plurality of cell rows and the second plurality of cell rows. The plurality of flip-flops include a first plurality of flip-flops configured to operate in response to the first clock and second clock signals.

An integrated circuit disclosed here includes a first plurality of cell rows, a second plurality of cell rows, first and second clock inverters, and a plurality of flip-flops. The second plurality of cell rows are arranged abutting the first plurality of cell rows. A first number of fins in the first plurality of cell rows is different from a second number of fins in the second plurality of cell rows. The first and second clock inverters are arranged in the second plurality of cell rows. The plurality of flip-flops are arranged in the first plurality of cell rows and the second plurality of cell rows. The plurality of flip-flops include a first plurality of flip-flops configured to operate in response to the first clock and second clock signals.

A chip and a chip testing method are provided. The chip includes a sending terminal circuit and a test circuit. The sending terminal circuit includes a signal sending unit and a first signal bump. The first signal bump is coupled to the signal sending unit. The test circuit is coupled to a circuit node between the signal sending unit and the first signal bump. The test circuit includes a first resistor, a unit gain buffer, and an analog-to-digital converter. A first terminal of the first resistor is coupled to the circuit node. A first input terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer. An input terminal of the analog-to-digital converter is coupled to the output terminal of the unit gain buffer.

A chip and a chip test method are provided. The chip includes a receiver circuit and a test circuit. The receiver circuit includes a signal receiving unit and a signal bump. The signal bump is coupled to the signal receiving unit. The test circuit is coupled to a circuit node between the signal receiving unit and the signal bump. The test circuit includes a digital-to-analog converter, a first resistor, and a unit gain buffer. A first terminal of the first resistor is coupled to the circuit node. An output terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A first input terminal of the unit gain buffer is coupled to an output terminal of the digital-to-analog converter. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer.

A chip and a chip test method are provided. The chip includes a receiver circuit and a test circuit. The receiver circuit includes a signal receiving unit and a signal bump. The signal bump is coupled to the signal receiving unit. The test circuit is coupled to a circuit node between the signal receiving unit and the signal bump. The test circuit includes a digital-to-analog converter, a first resistor, and a unit gain buffer. A first terminal of the first resistor is coupled to the circuit node. An output terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A first input terminal of the unit gain buffer is coupled to an output terminal of the digital-to-analog converter. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer.