A radiation detector includes a plurality of semiconductor light receiving elements and a plurality of reflection elements that segment a scintillator array. A plurality of respective segment areas by the reflection elements. A plurality of amplifiers amplify signals obtained from respective semiconductor light receiving elements. The scintillator array includes a plurality of scintillators. The radiation detector provides a first accumulator per segment area, and a first trigger generation circuit per segment area. The first trigger generation circuit generates a first trigger of the multiple signal added by the first accumulator for each of the plurality of respective segment areas. An encoder generates a single first trigger signal based on the first trigger.

An X-ray detector device includes in one example a switching portion and a photodetecting portion connected to the switching portion. The photodetecting portion includes a bottom electrode, a semiconductor area disposed above the bottom electrode, and a top electrode disposed above the semiconductor area. The area of the top electrode is smaller than the area of a top surface of the semiconductor area.

An electromagnetic radiation detection device comprises a matrix having a plurality of N rows divided into a plurality of M columns of cells, each cell comprising a plurality of diode segments responsive to electromagnetic radiation incident on said device. A scan driver provides a plurality of N scan line signals to respective rows of said matrix, each for enabling charge values from cells of a selected row of said matrix to be read. A reader reads a plurality of M variable charge value signals from respective columns of said matrix, each corresponding to a cell within a selected row of said matrix. Each diode segment is connected to a drive voltage sufficient to operate each diode segment in avalanche multiplication Geiger mode; and connected in series with an avalanche quenching resistor to said reader.

A tomographic imaging apparatus includes an X-ray detector comprising a plurality of dual mode pixels and configured to detect radiation that has passed through an object, and at least one processor configured to obtain scan data from the X-ray detector, and control each pixel of the plurality of dual mode pixels to operate in one of a first mode and a second mode, wherein each pixel of the plurality of dual mode pixels includes a sensor configured to generate a scan signal by converting incident radiation into an electric signal, a first signal path circuit configured to transmit the scan signal in the first mode, a second signal path circuit configured to transmit the scan signal in the second mode, and a photon counter configured to count photons from the scan signal transmitted through one of the first and second signal path circuits.

Detector module designs for radiographic imaging include first and second layers of scintillator rods or pixel arrays oriented in first and second directions. The first and second directions are transversely oriented to define a light sharing region between the first and second layers. Encoding features may be disposed in, on or between the first and second layers, and configured to modulate propagation of optical signals therealong or therebetween.

An array substrate for a digital X-ray detector, a digital X-ray detector including the same, and a method for manufacturing the same are disclosed. The array substrate reduces a step difference of a PIN diode, removes a bent part from a lower part to reduce characteristic deterioration of the PIN diode, and increases the size of a formation region of the PIN diode to increase a fill factor. To this end, the array substrate allows a source region of an active layer included in a thin film transistor to be in surface contact with a lower electrode of the PIN diode, and disposes the lower electrode over a planarized source region or a base substrate, such that a step difference of the PIN diode is reduced and fill factor is improved.

In order to provide a large-area radiation imaging apparatus that has an energy resolution while suppressing the occurrence of an artifact, the radiation imaging apparatus includes a detector and a signal processing unit. The detector includes a plurality of pixels for acquiring a pixel value in accordance with incident radiation. The signal processing unit performs signal processing for estimating energy of a radiation quantum of the incident radiation at a predetermined pixel included in the pixels using the amount of change in the pixel value of the predetermined pixel.

The present technology relates to a radiation detection apparatus that makes it possible to obtain a projection image of a radiation in a short period of time. The radiation detection apparatus includes a scintillator that emits scintillation light in response to incidence of a radiation, a pixel substrate on which a plurality of pixels each of which photoelectrically converts the scintillation light and outputs a pixel signal according to a light amount of the scintillation light is disposed in an array, a detection circuit substrate that includes an A/D (Analog to Digital) conversion unit for A/D converting the pixel signal and is stacked on the pixel substrate, and a compression unit that compresses digital data outputted from the A/D conversion unit. The present technology can be applied, for example, to an X-ray imaging apparatus that detects an X-ray to perform imaging and so forth.

Improvement of the dynamic range of a radiation detector is described. In one embodiment, one or more non-destructive readout operations are performed during a radiation exposure event to acquire data used to improve the dynamic range of the detector. In one implementation, one or more non-destructive readouts of pixels are performed prior to saturation of the pixels during an X-ray exposure so as to obtain non-saturated measurements at the pixels. In an additional implementation, non-destructive readouts of pixels are performed between exposure events so as to obtain an estimate of electronic noise during a multi-exposure examination.

Disclosed herein is an image sensor comprising: a plurality of packages arranged in a plurality of layers; wherein each of the packages comprises an X-ray detector mounted on a printed circuit board (PCB); wherein the packages are mounted on one or more system PCBs; wherein within an area encompassing a plurality of the X-ray detectors in the plurality of packages, a dead zone of the packages in each of the plurality of layers is shadowed by the packages in the other layers.