Patent classifications
G02B2006/12069
METHOD AND SYSTEM FOR VARIABLE OPTICAL THICKNESS WAVEGUIDES FOR AUGMENTED REALITY DEVICES
An augmented reality device includes a projector, projector optics optically coupled to the projector, and an eyepiece optically coupled to the projector optics. The eyepiece includes an eyepiece waveguide characterized by lateral dimensions and an optical path length difference as a function of one or more of the lateral dimensions.
BIASED TOTAL THICKNESS VARIATIONS IN WAVEGUIDE DISPLAY SUBSTRATES
A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.−7 to 10.sup.−6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.
WIDEBAND GRAPHENE-BASED ELECTRO-OPTIC ENTANGLER
A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.
WIDEBAND GRAPHENE-BASED ELECTRO-OPTIC ENTANGLER
A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.
Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
A technique for fabricating bumps on a substrate is disclosed. A substrate that includes a set of pads formed on a surface thereof is prepared. A bump base is formed on each pad of the substrate. Each bump base has a tip extending outwardly from the corresponding pad. A resist layer is patterned on the substrate to have a set of holes through the resist layer. Each hole is aligned with the corresponding pad and having space configured to surround the tip of the bump base formed on the corresponding pad. The set of the holes in the resist layer is filled with conductive material to form a set of bumps on the substrate. The resist layer is stripped from the substrate with leaving the set of the bumps.
Wideband graphene-based electro-optic entangler
A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.
Biased total thickness variations in waveguide display substrates
A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.−7 to 10.sup.−6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.
Optical plasmonic conductors comprising one or more fibrillar organic supramolecular species
Some embodiments are directed to optical conductors comprising one or more fibrillar organic supramolecular species including an association of triarylamines, methods of preparation and applications thereof as optical and plasmonic waveguides.
Protection layers for polymer modulators/waveguides
A polymer waveguide/modulator including a lower cladding layer, a polymer core, an upper cladding layer, a first protection/barrier layer sandwiched between the lower cladding layer and the core, and a second protection/barrier layer sandwiched between the core and the upper cladding layer. The protection/barrier layers designed to protect the cladding layers and the core from solvents and gases and to prevent current leakage between the cladding layers and the core. The first protection/barrier layer is optically transparent and designed with a refractive index less than, greater than, or the same as the refractive index of the core and approximately equal to the refractive index of the lower cladding layer. The second protection/barrier layer is optically transparent and designed with a refractive index less than, greater than, or the same as the refractive index of the core and approximately equal to the refractive index of the upper cladding layer.
WIDEBAND GRAPHENE-BASED ELECTRO-OPTIC ENTANGLER
A electronic method, includes receiving, by a graphene structure, a SPP mode of a particular frequency. The electronic method includes receiving, by the graphene structure, a driving microwave voltage. The electronic method includes generating, by the graphene structure, an entanglement between optical and voltage fields.