A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

Embodiments of the present disclosure are directed toward techniques and configurations for a single mode optical coupler device. In some embodiments, the device may include a multi-stage optical taper to convert light from a first mode field diameter to a second mode field diameter larger than the first mode field diameter, and a mirror formed in a dielectric layer under an approximately 45 degree angle with respect to a plane of the dielectric layer to reflect light from the multi-stage optical taper substantially perpendicularly to propagate the light in a single mode fashion. Other embodiments may be described and/or claimed.

Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.

The present invention relates to an optical light guide element having a first end section with a light entrance area designed for facing a light source and having a second end section with a light exit area designed for facing a light target area, wherein the light exit area is defined by a second surface area on the optical light guide element which faces a light target area, and wherein the light entrance area is defined by a first surface area on the optical light guide element which faces the light source, wherein the first end section comprises a first inclined surface area which forms an acute angle with the first surface area of the light entrance area, wherein the second end section forms a second inclined surface area which encloses an acute angle with the surface area of the light exit area, characterized in that said first surface area on the optical light guide element which faces the light source comprises a first replicated polymer lens.

An optical device includes a semiconductor laser light source, a grating element and an optical transmission element. The grating element includes a ridge-type optical waveguide having an incident surface to which a semiconductor laser light is incident and an emitting surface from which an outgoing light having a desired wavelength is emitted, and a Bragg grating formed in the ridge-type optical waveguide. The light transmission element includes an optical transmission part having an incident surface to which the outgoing light from the ridge-type optical waveguide is incident. A near-field diameter in a horizontal direction at the incident surface of the optical transmission part is greater than a near-field diameter in the horizontal direction at the emitting surface of said ridge-type optical waveguide.

Optical alignment of optical subassembly and optoelectronic device is achieved using an external source and an external receiver, passing optical signal through a passive waveguide in the optoelectronic device, via alignment reflective surface features provided on the optical subassembly. The optical subassembly is provided with a first alignment reflective surface directing alignment signal from the source to a grating coupler at the input of the waveguide, and a second alignment reflective surface directing to the receiver the alignment signal directed from a grating coupler at the output of the waveguide after the alignment signal has been transmitted from the input to the output through the waveguide. By adjusting the relative position between the optical subassembly and the optoelectronic device, and detecting the maximum optical power of the alignment signal reflected from the second alignment reflective surface, the position of best optical alignment of the optical subassembly and the optoelectronic device can be determined.

An optical scanning device includes: a first waveguide that propagates light by total reflection; and a second waveguide. The second waveguide includes: a first multilayer reflective film; a second multilayer reflective film that faces the first multilayer reflective film; and a first optical waveguide layer directly connected to the first waveguide and located between the first and second multilayer reflective films. The first optical waveguide layer has a variable thickness and/or a variable refractive index and propagates the light transmitted through the first waveguide. The first multilayer reflective film has a higher light transmittance than the second multilayer reflective film and allows part of the light propagating through the first optical waveguide layer to be emitted to the outside. By changing the thickness of the first optical waveguide layer and/or its refractive index, the direction of the part of the light emitted from the second waveguide is changed.

Inverted 45° semiconductor mirrors as vertical optical couplers for PIC chips, particularly optical receivers and transmitters. An inverted 45° semiconductor mirror functions to couple light between a plane in the PIC chip defined by thin film layers and a direction normal to a top surface of the PIC chip where it may be generated or collected by an off-chip component, such as a wire terminal. In an exemplary embodiment, a (110) plane of a cubic crystalline semiconductor may provide a 45° facet inverted relative to a (100) surface of the semiconductor from which light is to be emitted. In further embodiments, a (110) plane may be exposed by undercutting a device layer of a semiconductor on insulator (SOI) substrate. Alternatively, a pre-etched substrate surface may be bonded to a handling wafer, thinned, and then utilized for PIC waveguide formation.

An optical device includes a first waveguide that propagates light in a first direction; and a second waveguide including a first mirror, a second mirror, and an optical waveguide layer. The first mirror extends in the first direction and has a first reflecting surface, and the second mirror extends in the first direction and has a second reflecting surface. The optical waveguide layer is located between the first and second mirrors and propagates the light in the first direction. A forward end portion of the first waveguide is disposed inside the optical waveguide layer. In a region in which the first and second waveguides overlap each other when viewed in a direction perpendicular to the first reflecting surface, at least part of the first waveguide and/or at least part of the second waveguide includes at least one grating whose refractive index varies periodically in the first direction.

An optical system for adjusting a proportion of light of a particular spectral band that is emitted from the optical system. A dichroic mirror is configured to reflect light of a first spectral band from a light source towards a distal end of an optical fiber while allowing light of a second spectral band to pass through the dichroic mirror. The second mirror is positioned behind the dichroic mirror and is configured to reflect light of the second spectral band. A mirror actuator is coupled to the second mirror and is configured to adjust a proportion of the light of the second spectral band that is emitted by the optical system by adjusting a position of the second mirror relative to the dichroic mirror.