The invention concerns a method of manufacturing a modulated optically diffractive grating and a corresponding grating. The method comprises providing a substrate and manufacturing a plurality of temporary elements onto the substrate, the temporary elements being arranged in a periodic pattern comprising at least two periods having different element characteristics. Next, a first deposition layer is deposited so as to at least partially cover the temporary elements with the first deposition layer and the temporary elements are removed from the substrate in order to form onto the substrate a modulated diffractive grating of first grating elements made of the first deposition layer, the pattern comprising within each period a plurality of first grating elements and one more gaps between the first grating elements. The invention allows for producing high-quality gratings with locally varying diffraction efficiency.

The present disclosure provides a waveguide structure including an optical component. The optical component includes a plurality of grating coupler teeth over a semiconductive substrate and a plurality of grating coupler openings between adjacent grating coupler teeth, wherein the grating coupler openings are configured to receive a light wave. Each of the grating coupler teeth includes a dielectric stack and an etch stopper embedded in the dielectric stack, wherein the etch stopper has a resistance to a fluorine solution that is higher than that of the dielectric stack. A method of manufacturing a semiconductor device is also provided.

A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

The present disclosure provides a semiconductor device package. The semiconductor device package includes a semiconductor substrate having a first surface and a first optical coupler disposed on the first surface of the semiconductor substrate. The first optical coupler includes a first surface facing away from the first surface of the semiconductor substrate and a first lateral surface connected to the first surface of the first optical coupler. The first surface of the first optical coupler and the first lateral surface of the optical coupler define an angle greater than 90 degrees. A method of manufacturing a semiconductor device package is also disclosed.

In part, the disclosure relates to system. The system includes a polarization diversified wavelength demultiplexer (WDM). The polarization diversified wavelength demultiplexer includes a polarization beam splitter configured to output a first polarized signal and a second polarized signal based on an input signal; and a wavelength demultiplexer (WDM) having two inputs that are connected to the two outputs of the polarization beam splitter, and configured to output signals with a single set of outputs that carry signals of both polarizations, based on the first polarized signal from the first input and the second polarized signal from the second input.

An optical coupler includes a substrate, a mirror layer, a plurality of coupling gratings, a plurality of waveguides, and an oxide layer. The substrate includes a first surface, a second surface opposite to the first surface, and a concave portion exposed from the first surface. The mirror layer is disposed in the concave portion. The coupling gratings are disposed above the mirror layer. The waveguides are laterally aligned with the coupling gratings. The concave portion faces both the coupling gratings and the waveguides. The oxide layer is bonded on the first surface. The coupling gratings and the waveguides are disposed on the oxide layer.

A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

A waveguide is disclosed for use in an augmented reality or virtual reality display. The waveguide includes a plurality of optical structures exhibiting differences in refractive index from a surrounding waveguide medium. The optical structures are arranged in an array to provide at least two diffractive optical elements overlaid on one another in the waveguide. Each of the two diffractive optical elements is configured to receive light from an input direction and couple it towards the other diffractive optical element which can then act as an output diffractive optical element, providing outcoupled orders towards a viewer. The optical structures have a shape, when viewed in the plane of the waveguide, comprising a plurality of substantially straight sides having respective normal vectors at different angles and this can effectively reduce the amount of light that is coupled out of the waveguide on first interaction with the optical structures.

A waveguide is disclosed for use in an augmented reality or virtual reality display. The waveguide includes a plurality of optical structures (10, 20, 30, 40, 50, 60, 70, 80) exhibiting differences in refractive index from a surrounding waveguide medium. The optical structures are arranged in an array to provide at least two diffractive optical elements (H1, H2) overlaid on one another in the waveguide. Each of the two diffractive optical elements is configured to receive light from an input direction and couple it towards the other diffractive optical element which can then act as an output diffractive optical element, providing outcoupled orders towards a viewer. The optical structures have a shape, when viewed in the plane of the waveguide, comprising a plurality of substantially straight sides having respective normal vectors at different angles and this can effectively reduce the amount of light that is coupled out of the waveguide on first interaction with the optical structures.

Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.