A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.

This disclosure describes circuit boards configured for optical data transmission using fibers of the reinforcing material of the circuit board substrate as optical fibers. The disclosure is directed to circuit boards that include a plurality of fibers and a dielectric matrix material. Each fiber of the plurality of fibers includes a core material substantially transparent to a wavelength range of interest and a cladding material. The refractive index of the cladding material is less than a refractive index of the core material. The plurality of fibers are interwoven in a weave. The weave is at least partially encapsulated by the dielectric matrix material. The weave provides structural support for the circuit board and a plurality of optical paths for optical signals.

An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.

A quantum device for interfacing Lanthanide ions with optical fields or microwave fields or both. The device includes waveguides or resonators or both for optical fields or microwave fields or for both. The device includes at least one surface to which a single customized Lanthanide molecular complex, or an ensemble, layer, multilayer or crystal of such, are attached or bonded. This places the Lanthanide ions within the optical or microwave fields or both. The ability to customize the molecular structure around each Lanthanide ion, and to control their orientation and position and nano-environment in general, enables minimizing the host lattice effects and non-radiative loss channels for each ion, and increasing their homogeneity. Accordingly, the advantages of the present invention include reduced inhomogeneities, narrower linewidths, extended fluorescence and coherence times, and higher operation temperatures. Devices which benefit from the present invention include lasers, amplifiers, sensors, quantum memories, repeaters and quantum information processing devices at optical fields, microwave fields, or both, including bi-directional optical-microwave convertors.

Consistent with the present disclosure, a coherent receiver PIC may be provided having waveguides that may be routed in a substantially U-shaped bend to feed both an incoming signal and a local oscillator signal into a 90-degree optical hybrid circuit, which may include a multi-mode interference (MMI) device. As a result, one or more local oscillator lasers may be provided between optical hybrid circuits in certain examples, and, in other examples, optical waveguides feeding optical signals to the optical hybrids are provided between the optical hybrid circuits. In both examples, a more compact receiver PIC layout may be achieved without waveguide crossings, that can be linearly scaled to accommodate reception of additional signals or channels without added complexity.

A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.

Methods and systems for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement may include a photonic chip comprising an input waveguide and a photodiode. The photodiode comprises an absorbing region with a p-doped region on a first side of the absorbing region and an n-doped region on a second side of the absorbing region. An optical signal is received in the absorbing region via the input waveguide, which is offset to one side of a center axis of the absorbing region; an electrical signal is generated based on the received optical signal. The first side of the absorbing region may be p-doped. P-doped and n-doped regions may alternate on the first and second sides of the absorbing region along the length of the photodiode. The absorbing region may comprise germanium, silicon, silicon/germanium, or similar material that absorbs light of a desired wavelength.

An optical component assembly is provided including a substrate. The assembly includes an optical transmitter configured to transmit an optical signal, an optical receiver configured to receive the optical signal, and an optical waveguide extending between the optical transmitter and the optical receiver. The assembly further includes a frangible region defining a first portion of the substrate and a second portion of the substrate, wherein the frangible region is configured to allow the first portion to be separated from the second portion. The assembly may be configured to be modified from a testing configuration, in which the first portion is integrally connected to the second portion via the frangible region, to an operational configuration, in which the first portion is separated from the second portion such that communication of optical signals between the optical transmitter and the optical receiver is precluded.

An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.

Structures for an edge coupler and methods of fabricating a structure for an edge coupler. The structure comprises an edge coupler including a first waveguide core and a second waveguide core adjacent to the first waveguide core in a lateral direction. The first waveguide core includes a first section with a first thickness and a first plurality of segments projecting in a vertical direction from the first section. The second waveguide core includes a second section with a second thickness and a second plurality of segments projecting in the vertical direction from the second section.