A circuit board with a conductor path having a recess, an implant with left, right, lower and upper edges arranged in the recess, where the implant has first and second optical layers, a second optical layer and a conductor arranged between them, the first and the second optical layer each have at least one light-conducting structure with first and second ends, where a light-conductor is arranged in a right edge of the implant, in which respective second ends of the light-conducting structures are located, such that light fed in at the first end of the optical fiber of the first optical layer is deflected to the second end of the light-conducting structure of the second optical layer such that a beam path of the light encompasses the conductor, and the circuit also includes an optical transmitter and an optical receiver with and evaluator that form a fiber optic current sensor.

Embodiments include a fiber to photonic chip coupling system including a collimating lens which collimate a light transmitted from a light source and an optical grating including a plurality of grating sections. The system also includes an optical dispersion element which separates the collimated light from the collimating lens into a plurality of light beams and direct each of the plurality of light beams to a respective section of the plurality of grating sections. Each light beam in the plurality of light beams is diffracted from the optical dispersion element at a different wavelength a light beam of the plurality of light beams is directed to a respective section of the plurality of grating sections at a respective incidence angle based on the wavelength of the light beam of the plurality of light beams to provide optimum grating coupling.

A light waveguide includes a first cladding layer, a groove formed in the first cladding layer, a core layer embedded in the groove, and a second cladding layer formed on the first cladding layer and the core layer. A width and thickness of one end of the core layer are larger than a width and thickness of the other end of the core layer.

A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

Tapered waveguides made of high-index material attached to a tapered optical fiber are provided, enabling access to the optical modes of large, high-index resonators. In some embodiments, an optical fiber having a central axis, a tapered portion, and an untapered portion is provided. The tapered portion is configured to expose an evanescent field. An elongated waveguide is optically coupled to the optical fiber along the tapered portion and parallel to the central axis of the optical fiber. The elongated waveguide has a substantially triangular cross section perpendicular to the central axis of the optical fiber.

A gradient-index lens couples light from a laser active region to a waveguide core. The gradient-index lens includes a plurality of bilayers, each of the bilayers having first and second material of respective first and second refractive indices. The bilayers conform to a planar base of the gradient-index lens and further conform to input and output sidewalls of the gradient-index lens. The input sidewall faces the laser active region and the output sidewall faces away from the laser active region. The input and output sidewalls are tilted at respective acute angles relative to the planar base.

Consistent with the present disclosure, a coherent receiver PIC may be provided having waveguides that may be routed in a substantially U-shaped bend to feed both an incoming signal and a local oscillator signal into a 90-degree optical hybrid circuit, which may include a multi-mode interference (MMI) device. As a result, one or more local oscillator lasers may be provided between optical hybrid circuits in certain examples, and, in other examples, optical waveguides feeding optical signals to the optical hybrids are provided between the optical hybrid circuits. In both examples, a more compact receiver PIC layout may be achieved without waveguide crossings, that can be linearly scaled to accommodate reception of additional signals or channels without added complexity.

A light waveguide includes a first cladding layer, a groove formed in the first cladding layer, a core layer embedded in the groove, and a second cladding layer formed on the first cladding layer and the core layer. A width and thickness of one end of the core layer are larger than a width and thickness of the other end of the core layer.

A fiber optic cable includes a first optical fiber, a jacket, and a second optical fiber. The first optical fiber includes a glass core and cladding. The glass core is configured to provide controlled transmission of light through the fiber optic cable for high-speed data communication. The jacket has an interior surface that defines a conduit through which the first optical fiber extends. The jacket further has an exterior surface that defines the outside of the fiber optic cable. The second optical fiber is integrated with the exterior surface of the jacket.

A method of forming an optical fibre assembly, comprises providing a planar substrate made of a first material; positioning an optical fibre with an outer layer of a first glass material on a surface of the substrate to form a pre-assembly; depositing a further glass material such as silica soot onto the pre-assembly, over at least a part of the optical fibre and adjacent parts of the substrate surface; and heating the pre-assembly to consolidate the further glass material into an amorphous volume in contact with at least parts of the surface of the substrate and the outer layer of the optical fibre, thereby bonding the optical fibre to the substrate to create the optical fibre assembly.