Example implementations described herein are directed to a system involving one or more photonic integrated circuits having multi-mode waveguides and connected to a printed optical board through the use of multi-mode waveguide connectors described herein. The printed optical board can include an embedded multi-mode waveguide bus to facilitate optical signal to and from the photonic integrated circuits. The system can also include a chiplet such as a photonic integrated circuit with a single mode waveguide configured to connect to an optical fiber cable.

One feature pertains to an apparatus that includes apparatus that includes an evanescent field coupler having a first surface that evanescently couples light between the evanescent field coupler and an open dielectric resonator. The apparatus also includes a thin film coating covering at least a portion of the first surface of the evanescent field coupler. The thin film coating is specifically designed so that the thin film coating reflects light of a first wavelength.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

A light splitting device includes an optical waveguide body and a dispersion grating. The optical waveguide body is configured to transmit incident light to the dispersion grating, the dispersion grating is configured to disperse the incident light transmitted by the optical waveguide body into a plurality of spectral lines, and the optical waveguide body is further configured to change propagation directions of the plurality of spectral lines and to emit the plurality of spectral lines.

One feature pertains to an apparatus that includes apparatus that includes an evanescent field coupler having a first surface that evanescently couples light between the evanescent field coupler and an open dielectric resonator. The apparatus also includes a thin film coating covering at least a portion of the first surface of the evanescent field coupler. The thin film coating is specifically designed so that the thin film coating reflects light of a first wavelength.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

According to one embodiment, an optical device includes a first mirror, a second mirror, and a first member. The first mirror has a first planar surface. The second mirror is spaced from the first mirror in a first direction crossing the first planar surface. The second mirror has a concave surface including a first region and a second region around the first region. First distance between the first region and the first planar surface in the first direction is longer than second distance between the second region and the first planar surface in the first direction. The first distance is half or less of curvature radius of the concave surface. The first member is light transmissive and solid. The first member includes a first portion provided between the first mirror and the second mirror. The first portion is in contact with the first planar surface and the concave surface.