A modular assembly for an imaging system can allow precision alignment to occur in isolated manufacturing stages, with the separate components being assembled together in later stages. An exemplary system includes a support structure, multiple imaging modules exchangeably coupled to the support structure and each including lenslets and a photonic integrated circuit (PIC) device arranged to receive light from the lenslets, multiple fiber arrays each connected to corresponding one of the multiple imaging modules, and a camera system connected to the fiber arrays. The lenslets the PIC device can be integrally coupled prior to assembly with the support structure, so that precise alignment of the lenslets with respect to the PIC device is performed in isolation.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die. The at least one reflector is disposed on the at least one prism structure.

One feature pertains to an apparatus that includes apparatus that includes an evanescent field coupler having a first surface that evanescently couples light between the evanescent field coupler and an open dielectric resonator. The apparatus also includes a thin film coating covering at least a portion of the first surface of the evanescent field coupler. The thin film coating is specifically designed so that the thin film coating reflects light of a first wavelength.

There is provided an optical system for coupling light into a waveguide. The optical system comprising a coupler arranged at a portion of the waveguide. The coupler has a surface with a grating structure for directing light into the waveguide formed therein. A cladding layer embeds the coupler and an optical path changing structure is formed in the cladding layer. The optical path changing structure has a refractive surface and a reflective surface, each forming an acute angle with respect to the surface of the coupler. Light which enters the optical path changing structure through the refractive surface will be refracted and directed towards the reflective surface. The reflective surface is arranged to reflect the light such that it is directed towards the grating structure of the coupler along a direction suitable for efficient coupling of light into the waveguide.

According to one embodiment, an optical device includes a first mirror, a second mirror, and a first member. The first mirror has a first planar surface. The second mirror is spaced from the first mirror in a first direction crossing the first planar surface. The second mirror has a concave surface including a first region and a second region around the first region. First distance between the first region and the first planar surface in the first direction is longer than second distance between the second region and the first planar surface in the first direction. The first distance is half or less of curvature radius of the concave surface. The first member is light transmissive and solid. The first member includes a first portion provided between the first mirror and the second mirror. The first portion is in contact with the first planar surface and the concave surface.

An electronic device may include a display that generates light for an optical system that redirects the light towards an eye box. The optical system may include a waveguide, a non-diffractive input coupler, a cross coupler, and an output coupler. The cross coupler may expand the light in a first direction. The cross coupler may perform an even number of diffractions on the light and may couple the light back into the waveguide at an angle suitable for total internal reflection. The output coupler may expand the light in a second direction while coupling the light out of the waveguide. The cross coupler may include surface relief gratings or holographic gratings embedded within the waveguide or formed in a separate substrate. The optical system may direct the light towards the eye box without chromatic dispersion and while supporting an expanded field of view and optical bandwidth.

A method of manufacturing a monolithic array of lenslets that inject light into waveguides without the need for alignment of a separate lenslet array and waveguide array is provided. The waveguide array may be incorporated as a monolithic or fused piece with the substrate on which the lenslet array is to be written. A method of producing a flat, thin monolithic collimator array having a form corresponding to that of a PIC, with the input/output lenslet array located on the top surface of the collimator array is provided. A method for bonding a two-dimensional (2-D) array of lenslets on top of a photonic integrated circuit (PIC) substrate with a small gap for thermal expansion between lenslet blocks is provided.

Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a yard, or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

According to one embodiment, an optical device includes a first mirror, a second mirror, and a first member. The first mirror has a first planar surface. The second mirror is spaced from the first mirror in a first direction crossing the first planar surface. The second mirror has a concave surface including a first region and a second region around the first region. First distance between the first region and the first planar surface in the first direction is longer than second distance between the second region and the first planar surface in the first direction. The first distance is half or less of curvature radius of the concave surface. The first member is light transmissive and solid. The first member includes a first portion provided between the first mirror and the second mirror. The first portion is in contact with the first planar surface and the concave surface.