Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

A wavelength division multiplexing filter and methods of forming the same include an optical dielectric filter having multiple dielectric layers. The optical dielectric filter has a high reflectivity at a first wavelength and a high transmissivity at one or more additional wavelengths. The dielectric layers include a structure of layers following the pattern L-[M/2-H-M/2]N-L, where L layers include a first dielectric material, H layers include a second dielectric material, M/2 layers have a mixture of the first and second dielectric material and have a thickness half that needed to provide reflectivity at the first wavelength, and N is a number of repetitions for the structure in brackets.

An electronic device may include a display that generates light for an optical system that redirects the light towards an eye box. The optical system may include a waveguide, a non-diffractive input coupler, a cross coupler, and an output coupler. The cross coupler may expand the light in a first direction. The cross coupler may perform an even number of diffractions on the light and may couple the light back into the waveguide at an angle suitable for total internal reflection. The output coupler may expand the light in a second direction while coupling the light out of the waveguide. The cross coupler may include surface relief gratings or holographic gratings embedded within the waveguide or formed in a separate substrate. The optical system may direct the light towards the eye box without chromatic dispersion and while supporting an expanded field of view and optical bandwidth.

Optical designs and techniques for providing compact optical delay lines by using a dual fiber collimator structured to include (1) an input fiber line that receives and guides an input light beam, (2) an output fiber line that guides and exports an output light beam that has an optical delay relative to the input light beam, and (3) a collimating lens placed on one side of end facets of the input and output fiber lines to receive the input light beam from the input fiber line and to output the output beam light to the output fiber line.

Optical designs and techniques for providing compact optical delay lines by using a dual fiber collimator structured to include (1) an input fiber line that receives and guides an input light beam, (2) an output fiber line that guides and exports an output light beam that has an optical delay relative to the input light beam, and (3) a collimating lens placed on one side of end facets of the input and output fiber lines to receive the input light beam from the input fiber line and to output the output beam light to the output fiber line.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.