An occupancy sensor covering a wide field in an integrated chip is disclosed. The occupancy sensor includes an array of grating coupled waveguide sensors wherein continuous wave (cw) signals monitor an ambient light field for dynamic changes on times scales of seconds, and high frequency signals map in three-dimensions of the space using time-of-flight (TOF) measurements, pixel level electronics that perform signal processing; array level electronics that perform additional signal processing; and communications and site level electronics that interface with actuators to respond to occupancy sensing.

An optical resonator system includes a multi-strip waveguide structure having spaced semiconductor strips for guiding an IR radiation, a STP resonance structure (STP=slab tamm-plasmon-polariton), wherein the STP resonance structure includes an alternating arrangement of semiconductor strips and interjacent dielectric strips and includes a metal strip adjacent to the semiconductor strip at a boundary region of the STP resonance structure, wherein the metal strip and the adjacent semiconductor strip are arranged to provide a metal-semiconductor interface, and wherein the semiconductor strips of the multi-strip waveguide structure and the semiconductor strips of the STP resonance structure are arranged perpendicular to each other, and an optical coupling structure having a semiconductor layer, wherein the semiconductor layer is arranged between the multi-strip waveguide structure and the STP resonance structure for optically coupling the IR radiation between the multi-strip waveguide structure and the STP resonance structure.

Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding,

An optical fiber sensor includes an optical fiber. The optical fiber includes a cladding having a cladding refractive index, and a plurality of fiber cores embedded in the cladding and extending along a longitudinal axis of the optical fiber. The plurality of fiber cores include a first subset of at least one first fiber core and a second subset of at least one second fiber core. The at least one first fiber core has a first core refractive index different from the cladding refractive index and a first core radius in a direction transverse to the longitudinal axis. The at least one second fiber core has a second core refractive index different from the cladding refractive index and a second core radius transverse to the longitudinal axis. The second core refractive index and the second core radius differ from the first core refractive index and the first core radius such that a temperature sensitivity of the at least one second fiber core differs from the temperature sensitivity of the first fiber core.

A signal transmission structure configured to transmit signals between an image module and an application processor is provided. An optoelectronic composite board including a circuit board and an optical waveguide module, and is configured to simultaneously transmit digital signals between the image module and the application processor in the form of electric and optical signals. By using the signal transmission structure having both electric and optical signals, transferring of a larger quantity of signals is enabled and transmission of digital data is accelerated.

Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.

The present application relates to a method for manufacturing an electro-optical device, wherein a waveguide (3) is provided (S1), a planarization coat (7) overlapping at least a section of the waveguide (3) is fabricated (S2), the planarization coat (7) is provided with a spin-on-glass coating (9) (S3), at least in the region of the spin-on-glass coating (9), a preferably dry chemical etching treatment is carried out (S4), optionally, the steps of providing the planarization coat (7) with a spin-on-glass coating (9) and the etching treatment are repeated at least once (S5, S6), and an active element (10) is provided (S7) on or above the planarization coat (7) and above the waveguide (3).

Aspects of the present disclosure are directed to process flow to fabricate a waveguide structure with a silicon nitride core having atomic-level smooth sidewalls achieved by wet etching instead of the conventional dry etching process. A mask is pre-biased to account for lateral etching during the wet-etching steps.

Provided are embodiments for method and system for performing an integrated ice protection with prognostics and health management using fiber optic sensors. Embodiments can include reading a signal from each sensor of an array of sensors installed on a surface of a structure or equipment, wherein each sensor is a fiber optic sensor, and generating a map based on reading the signal from each sensor, wherein the map monitors a condition of the surface detected by each sensor. Embodiments can also include determining at least one of an abnormal condition or a failure based at least in part on reading the signal from each sensor; and performing at least one of adjusting power control for the structure or equipment or communicating the abnormal condition or failure of the structure or equipment.

The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.