An optical switch has latched switch states and includes optical fibers that are laterally joined together to define an optical switching portion. At least one phase change material (PCM) layer is on the optical switching portion so that a phase of the PCM layer determines a latched switch state from among the latched switch states.

A large-scale single-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.

An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

Power consumption in MZI-based integrated photonic switches or filters throughout the operational life can be reduced by reducing fabrication-induced phase misalignment between the unpowered operational mode of the switch or filter and the predominant switch state, and/or by enabling low-power compensation for any such misalignment. In various embodiments, misalignment is reduced by increasing the width of the waveguides implementing the interferometer arms of the MZI, and/or by structuring a region containing the MZI symmetrically to diminish stress-induced misalignment. In some embodiments, phase tuners are used to actively compensate for any phase misalignment, with a tuner drive voltage substantially lower than used to switch to the non-dominant state.

Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.

A multi-speed transceiver device includes a chassis having an optical cable connector coupled to a transceiver processor, and an optical waveguide coupling. A data receiving subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data receiving optical waveguides, and transmits first data received from the transceiver processor to the optical waveguide coupling over a number of the data receiving optical waveguides that depends on a first data transmission speed at which the first data was received. A data transmission subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data transmission optical waveguides, and receives second data via the optical waveguide coupling and over a number of the data transmission optical waveguides that depends on a second data transmission speed at which the second data was received, and then transmits that second data to the transceiver processor.

An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting scalable optical modular optically switched interconnection network as well as temporospatial switching fabrics allowing switching speeds below the slowest switching element within the switching fabric.

An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

There is provided a small MCS with the number of leads reduced by half as compared with the conventional configuration. A multicast switch according to the present invention is formed on a substrate, comprising: M input ports, N output ports; M×N optical switch units (optical SU); optical waveguides optically connecting the M input ports, M×N optical SU, and N output ports; and leads connected to the respective M×N optical SU. A multicast switch is configured such that by activating one optical SU, an optical signal input to an input port associated with the activated optical SU is output from an output port associated with the activated optical SU. The M×N optical SU include at least a gate switch and a main switch. In each optical SU, the gate switch and the main switch are connected to the common lead.