According to various aspects of the present disclosure, an apparatus is provided. In an aspect, the apparatus includes an optical transceiver having a first port, a second port and an optical switch coupled to the first port and the second port. The optical switch is switchable between a unidirectional port operation mode and a bidirectional port operation mode. When the optical switch is in the unidirectional port operation mode, the first port is configured to send a first optical signal, and the second port configured to receive a second optical signal. When the optical switch is in the bidirectional port operation mode, the first port configured to send the first optical signal and receive the second optical signal, and the second port configured to receive a third optical signal and not send the first signal. Furthermore, a second bidirectional port operation mode is supported with the second port configured to send the first optical signal and receive the second optical signal, and the first port configured to receive a third optical signal and not send the first signal.

The LIDAR chip includes a utility waveguide that guides an outgoing LIDAR signal to a facet through which the outgoing LIDAR signal exits from the chip. The chip also includes a control branch that removes a portion of the outgoing LIDAR signal from the utility waveguide. The control branch includes a control light sensor that receives a light signal that includes light from the removed portion of the outgoing LIDAR signal. The chip also includes a data branch that removes a second portion of the outgoing LIDAR signal from the utility waveguide. The data branch includes a light-combining component that combines a reference light signal that includes light from the second portion of the outgoing LIDAR signal with a comparative light signal that includes light that was reflected off an object located off of the chip.

An integrated optical component, including a transparent pad arranged on the upper face of the basic optical component, the transparent pad including a plane mirror at its upper face, and the basic optical component including a convergent mirror at its upper face, the plane and convergent mirrors being arranged such that the light beam is propagated between the internal light gate and the external light gate by passing through the transparent pad by reflection on the plane mirror and by reflection on the convergent mirror.

A balanced homodyne detection optical circuit according to the present disclosure is a planar optical waveguide circuit in which a circuit made of an optical waveguide including a dielectric or a semiconductor is formed on a substrate, the balanced homodyne detection optical circuit including an input port of local oscillator light and an input port of measurement light (squeezed light (including excitation light)), wherein a wavelength demultiplexing circuit which demultiplexes only the measurement light is arranged immediately after the input port of measurement light, a 50% multiplexing/demultiplexing circuit is arranged which causes squeezed light having been demultiplexed by the wavelength demultiplexing circuit and the local oscillator light to respectively branch at a branching ratio of 50% and to interfere with each other, and two output ports are arranged to which two outputs from the 50% multiplexing/demultiplexing circuit are guided.

An optical device is disclosed, including a phase delay, a first adiabatic coupler adapted to receive an input signal and adapted to be optically coupled to an input of the phase delay, and a second adiabatic coupler adapted to be optically coupled to an output of the phase delay. The second adiabatic coupler includes a first waveguide including a first portion optically coupled to the first output and including a first width, and a second waveguide including a second portion optically coupled to the second output and including a second width that is approximately equal to the first width.

A device includes a photonic routing structure including a silicon waveguide, photonic devices, and a grating coupler, wherein the silicon waveguide is optically coupled to the photonic devices and to the grating coupler; an interconnect structure on the photonic routing structure, wherein the grating coupler is configured to optically couple to an external optical fiber disposed over the interconnect structure; and computing sites on the interconnect structure, wherein each computing site includes an electronic die bonded to the interconnect structure, wherein each electronic die of the computing sites is electrically connected to a corresponding photonic device of the photonic devices.

Disclosed is a compact on-chip polarization splitter-rotator based on a Bezier curve gradient waveguide. The Bezier curve gradient waveguide structure is a standard SOI-based wafer structure, comprising a substrate, of which the bottom layer is buried with oxide (SiO.sub.2), and the top is composed of silicon waveguides, including a common output waveguide and a specially-structured waveguide containing Bessel curve boundaries. The common waveguide structure is composed of a cuboid waveguide, and the specially-structured waveguide is composed of an input region, an output region, a width-gradient waveguide (Bezier curve gradient structure) and a coupling region, where a width of the gradient waveguide is determined by a third-order Bezier curve, and the coupling region is composed of two asymmetrical waveguide regions.

A photonic integrated circuit (PIC) includes one or more couplers to interface a light source with the PIC, a splitter directly coupled to the one or more couplers at a coupling point of the PIC, a modulator to receive light from the couplers, and a connecting waveguide to connect the splitter to the modulator. The waveguide may be a rib waveguide. The PIC may be integrated with devices such as a CWDM or a PSM device, and may provide improved performance and lower attention for high optical power applications.

A grating coupler integrated in a photonically-enabled circuit and a method for fabricating the same are disclosed herein. In some embodiments, the grating coupler includes a substrate comprising a silicon wafer, a first grating region etched into the substrate, wherein the first grating region comprises a first plurality of gratings having a first predetermined height, and a second grating region etched into the substrate, wherein the second grating region comprises a second plurality of gratings having a second predetermined height and wherein the first and second predetermined heights are not identical.

Semiconductor device includes light-emitting die and semiconductor package. Light emitting die includes substrate and first conductive pad. Substrate has emission region located at side surface. First conductive pad is located at bottom surface of substrate. Semiconductor package includes semiconductor-on-insulator substrate, interconnection structure, second conductive pad, and through semiconductor via. Semiconductor-on-insulator substrate has linear waveguide formed therein. Interconnection structure is disposed on semiconductor-on-insulator substrate. Edge coupler is embedded within interconnection structure and is connected to linear waveguide. Semiconductor-on-insulator substrate and interconnection structure include recess in which light-emitting die is disposed. Edge coupler is located close to sidewall of recess. Second conductive pad is located at bottom of recess. Through semiconductor via extends across semiconductor-on-insulator substrate to contact second conductive pad. First conductive pad is connected to through semiconductor via. Emission region directly faces sidewall of recess where edge coupler is located.