Patent classifications
G02B2006/12147
Broadband back mirror for a photonic chip
A semiconductor laser has a mirror formed in a gain chip. The mirror can be placed in the gain chip to provide a broadband reflector to support multiple lasers using the gain chip. The mirror can also be placed in the gain chip to have the semiconductor laser be more efficient or more powerful by changing an optical path length of the gain of the semiconductor laser.
Photonic circulator for a LiDAR device
A photonic circulator deployed on a chip-scale light-detection and ranging (LiDAR) device includes a first arm that includes a first waveguide that is bonded onto a first member at a first bonding region, and a second arm that includes a second waveguide that is bonded onto a second member at a second bonding region. A first thermo-optic phase shifter is arranged on the first member and collocated with the first waveguide, and a second thermo-optic phase shifter is arranged on the second member and collocated with the second waveguide. The magneto-optic material and the first thermo-optic phase shifter of the first member cause a first phase shift in a first light beam travelling through the first waveguide, and the magneto-optic material and the second thermo-optic phase shifter of the second member cause a second phase shift in a second light beam travelling through the second waveguide.
Optical coupler, grating structure and forming method thereof
An optical coupler includes a substrate, a mirror layer, a plurality of coupling gratings, a plurality of waveguides, and an oxide layer. The substrate includes a first surface, a second surface opposite to the first surface, and a concave portion exposed from the first surface. The mirror layer is disposed in the concave portion. The coupling gratings are disposed above the mirror layer. The waveguides are laterally aligned with the coupling gratings. The concave portion faces both the coupling gratings and the waveguides. The oxide layer is bonded on the first surface. The coupling gratings and the waveguides are disposed on the oxide layer.
Heterogeneous spectroscopic transceiving photonic integrated circuit sensor
Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
AN ULTRA-COMPACT SILICON WAVEGUIDE MODE CONVERTER BASED ON META-SURFACE STRUCTURE
A compact silicon waveguide mode converter, a dielectric meta-surface structure based on periodical oblique subwavelength perturbations, including a top silicon structure with oblique subwavelength perturbations etched in certain periods with period length of Λ, a duty cycle and an oblique angle θ on the SOI substrate. The invention adopts an all-dielectric meta-surface structure with oblique subwavelength perturbation, which can achieve a compact mode conversion from fundamental mode to arbitrary high-order mode of silicon waveguide, and can improve the optical communication capacity greatly.
OPTICAL PHASED ARRAY ARCHITECTURE FOR WAVEFRONT SENSING
An optical phased array (OPA) photonic integrated chip includes a plurality of array elements, a plurality of phase shifters, a plurality of combiners, and an edge coupler configured to couple to a single mode waveguide. The plurality of phase shifters includes a layer of phase shifters that has a phase shifter connected to each array element in the plurality of array elements. The plurality of combiners is configured to connect the plurality of phase shifters to the edge coupler. The plurality of combiners includes a first combiner that has a first output that is connected to a second combiner or the edge coupler, and a second output of the first combiner is connected to a photodetector. An in-phase light portion at the first combiner is output through the first output, and an out-of-phase light portion at the first combiner is output through the second output.
Recirculating programmable photonic circuits and operating method thereof
Disclosed herein is a recirculating programmable photonic circuit including a programmable optical coupler including two first programmable waveguides and configured to adjust optical coupling efficiency of an optical signal based on a vertical movement of one of the two first programmable waveguides, a phase shifter including a second programmable waveguide and configured to change a phase of the optical signal based on a horizontal movement of the second programmable waveguide with respect to the first programmable waveguides, a plurality of core cells connected to each of the programmable optical coupler and the phase shifter to form a predetermined shape, the core cells being selectively driven by moving the optical signal from the predetermined shape according to the optical coupling efficiency and the phase, and an actuator electrically connected to one side of each of the plurality of core cells and configured to control the vertical movement and the horizontal movement.
PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH AT LEAST ONE TAPERED SIDEWALL LINER ADJACENT TO A WAVEGUIDE CORE
Disclosed are embodiments of a photonic integrated circuit (PIC) structure with a waveguide core having tapered sidewall liner(s) (e.g., symmetric tapered sidewall liners on opposing sides of a waveguide core, asymmetric tapered sidewall liners on opposing sides of a waveguide core, or a tapered sidewall liner on one side of a waveguide core). In some embodiments, the tapered sidewall liner(s) and waveguide core have different refractive indices. In an exemplary embodiment, the waveguide core is a first material (e.g., silicon) and the tapered sidewall liner(s) is/are a second material (e.g., silicon nitride) with a smaller refractive index than the first material. In another exemplary embodiment, the waveguide core is a first compound and the tapered sidewall liner(s) is/are a second compound with the same elements (e.g., silicon and nitrogen) as the first compound but with a smaller refractive index. Also disclosed are method embodiments for forming such a PIC structure.
Optical Waveguide
In a waveguide having a given Δ, a low-loss waveguide bend is realized while the curvature radius is kept small. In an optical waveguide in which a first waveguide and a second waveguide are connected, a clothoid tapered waveguide bend is inserted between the first waveguide and the second waveguide. In the clothoid tapered waveguide bend, the waveguide width continuously changes from a first waveguide width at a connection point of the first waveguide to a second waveguide width at a connection point of the second waveguide, the curvature radius continuously changes from a first curvature radius at the connection point of the first waveguide to a second curvature radius at the connection point of the second waveguide, the first waveguide width and the second waveguide width are different from each other, and the first curvature radius and the second curvature radius are different from each other.
Optical Connecting Device, Optical Device, and Method for Manufacturing Optical Device
An optical connection element includes a first waveguide core and a second waveguide core above a substrate or a cladding and in which signal light and resin curing light propagate through the first waveguide core and the second waveguide core, the optical connection element including: an inter-core light coupling section in which a part of the first waveguide core and a part of the second waveguide core overlap in a perpendicular direction; and a resin curing light coupling section that couples resin curing light to the second waveguide core.