An integrated photonic circulator is described, an application of which may be deployed on a chip-scale light-detection and ranging (LiDAR) device. The photonic circulator includes a micro-ring resonator waveguide, a heating element, first and second bus waveguides, a magneto-optic substrate, a magneto-optic element, a magnetic ring disposed on a photonic substrate, and a silicon substrate. The first and second bus waveguides are coupled to the micro-ring resonator waveguide, and the micro-ring resonator waveguide is affixed onto a first side of the photonic substrate. The magneto-optic element and the magneto-optic substrate are arranged on the micro-ring resonator waveguide, the magnetic ring is affixed to the magneto-optic substrate, the heating element is affixed to the photonic substrate, the photonic substrate is affixed to the silicon substrate, and the magnetic ring is concentric with the micro-ring resonator.

An architecture for a chip-scale optical phased array-based scanning frequency-modulated continuous wave (FMCW) Light-detection and ranging (LiDAR) device is described. The LiDAR device includes a laser, a transmit optical splitter, an optical circulator, photodetectors, and an optical phased array. The laser, the transmit optical splitter, the optical circulator, the photodetectors, and the optical phased array are arranged as a chip-scale package on a single semiconductor substrate. The laser generates a first light beam that is transmitted to the optical phased array aperture via the transmit optical splitter, the optical circulator, and the optical phased array. A fraction of the first light beam is transmitted to the photodetectors via the transmit optical splitter to serve as the optical local oscillator (LO), the aperture of the optical phased array captures a second light beam that is transmitted to the photodetectors via the optical phased array and the optical circulator.

A silicon photonics substrate for a transceiver includes a substrate member comprised of a first silicon material, and, heterogeneously formed on the substrate member, receiver circuitry and transmitter circuitry. The receiver circuitry is comprised of a second silicon material and is configured to receive a coherent input signal, generate first and second oscillator signals based on light input from a laser diode, and detect a transverse electric (TE) mode signal and a transverse magnetic (TM) mode signal in the coherent input signal based on the first and second oscillator signals. The transmitter circuitry is comprised of the second or a third silicon material and is configured to transmit signals having the two or more possible modulation formats and modulate the light input from the laser diode in either a TE mode or a TM mode to generate a coherent output signal.

An apparatus including a light detection and ranging (LiDAR) antenna of an optical phased array includes a silicon-on-insulator substrate including a silicon wire waveguide embedded within the substrate and a grating layer disposed over the substrate. The grating layer includes a silicon nitride layer coating the silicon-on-insulator substrate and including a plurality of etchings formed in a direction perpendicular to a longitudinal axis of the optical phased array and a silicon oxynitride layer coating the silicon nitride layer and filling the etchings. The etchings are relatively thin in the direction of the longitudinal axis of the optical phased array at a first end of the optical antenna and are relatively thick in the direction of the longitudinal axis at a second end. The etchings gradually increase in thickness between the first end of the optical phased array and the second end of the optical antenna.

Techniques for signal amplification for a photonic integrated circuit (PIC) die are disclosed. In the illustrative embodiment, an optical fiber is coupled to an input signal waveguide in a glass interposer, and an input signal waveguide of a PIC die is coupled to the input signal waveguide of the glass interposer. In order to compensate for any coupling losses, the input signal waveguide of the glass interposer is active, amplifying an input signal. Light in a pump waveguide near the input signal waveguide pumps ions in the input signal waveguide into a population inversion, allowing them to amplify the input signal.

A silicon photonics substrate for a transceiver includes a substrate member comprised of a first silicon material, and, heterogeneously formed on the substrate member, receiver circuitry and transmitter circuitry. The receiver circuitry is comprised of a second silicon material and is configured to receive a coherent input signal, generate first and second oscillator signals based on light input from a laser diode, and detect a transverse electric (TE) mode signal and a transverse magnetic (TM) mode signal in the coherent input signal based on the first and second oscillator signals. The transmitter circuitry is comprised of the second or a third silicon material and is configured to transmit signals having the two or more possible modulation formats and modulate the light input from the laser diode in either a TE mode or a TM mode to generate a coherent output signal.

Optical splitters and system and methods utilizing optical splitters are disclosed. The optical splitter may include an input waveguide, a free propagation region, and a plurality output waveguides. The output waveguides are connected to the free propagation region at a corresponding plurality of output ports that are positioned along a non-circular path. The output ports may be positioned such that the output waveguides have the same width.

An optical modulator includes a photonic substrate a first modulator arm disposed on the photonic substrate. The first modulator arm is configured to modulate a first optical signal portion of an input optical signal at a first signal level. The optical modulator further includes a second modulator arm disposed on the photonic substrate. The second modulator arm is configured to modulate a second optical signal portion of the input optical signal at a second signal level that is different from the first signal level. The optical modulator further includes an optical combiner configured combine the first optical signal portion at the first signal level and the second optical signal portion at the second signal level to impart a target chirp onto the recombined optical signal. The target chirp is based on a signal level difference between the first signal level and the second signal level.

Configurations for an optical system used for guiding light and reducing back-reflection back in an output waveguide is disclosed. The optical system may include an output waveguide defined in a slab waveguide. The output waveguide may terminate before an output side of the slab waveguide, which may reduce the back-reflection of light from the output side back into the output waveguide. The output side may define an optical element that may steer the output light. The optical element may collimate the output light, cause the output light to converge, or cause the output light to diverge.

Structures for an edge coupler and methods of forming a structure for an edge coupler. The structure includes a waveguide core over a dielectric layer, and a back-end-of-line stack over the waveguide core and the dielectric layer. The back-end-of-line stack includes an interlayer dielectric layer, a side edge, a first feature, a second feature, and a third feature laterally arranged between the first feature and the second feature. The first feature, the second feature, and the third feature are positioned on the interlayer dielectric layer adjacent to the side edge, and the third feature has an overlapping relationship with a tapered section of the waveguide core.