Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.

The disclosed structures and methods are directed to a chip for an optical gyroscope and methods of manufacturing of the chip for the optical gyroscope. The chip comprises a substrate, a waveguide having a first waveguide cladding layer and a waveguide core; and a ring resonator having a first ring cladding layer and a ring resonator core attached to the first ring cladding layer. A side wall of the ring resonator core forms an obtuse angle with an upper surface of the substrate. The method comprises depositing a first cladding layer on an upper surface of a silicon substrate; depositing a core layer; depositing a resist mask pattern to define a form of a ring resonator core and a form of a waveguide core; etching the core layer outside of the resist mask pattern; and stripping the resist mask pattern off.

Methods are disclosed for fabricating molds for forming eyepieces having waveguides with integrated spacers. The molds are formed by etching deep holes (e.g., 5 μm to 1000 μm deep) into a substrate using a wet etch or dry etch. The etch masks for defining the holes may be formed with a thick metal layer and/or multiple layers of different metals. A resist layer may be disposed over the etch mask. The resist layer may be patterned to form a pattern of holes, the pattern may be transferred to the etch mask, and the etch mask may be used to transfer the pattern into the underlying substrate. The patterned substrate may be utilized as a mold onto which a flowable polymer may be introduced and allowed to harden. Hardened polymer in the holes may form integrated spacers. The hardened polymer may be removed from the mold to form a waveguide with integrated spacers.

The present disclosure relates to systems and methods relating to the fabrication of light guide elements. An example system includes an optical component configured to direct light emitted by a light source to illuminate a photoresist material at one or more desired angles so as to expose an angled structure in the photoresist material. The photoresist material overlays at least a portion of a first surface of a substrate. The optical component includes a container containing a light-coupling material that is selected based in part on the one or more desired angles. The system also includes a reflective surface arranged to reflect at least a first portion of the emitted light to illuminate the photoresist material at the one or more desired angles.

A method for producing a planar light circuit is specified. The method comprises: providing a substrate free of light producing regions, depositing a waveguide layer, applying a photostructurable mask on the waveguide layer, photostructuring of the photostructurable mask such that the photostructurable mask is removed in regions, etching of the waveguide layer in the regions such that channels are produced in the waveguide layer, wherein the channels confine waveguides, removal of the photostructurable mask layer, and singulating into a planar light circuit.

Furthermore, a planar light circuit is specified.

A device includes a substrate and nanoscale fin formed from a first material, a RF emitter that emits energy in a range of radio frequencies, and a waveguide formed from a second material. The device further includes a bichromatic directional coupler configured to couple pump and probe laser light into the waveguide. The waveguide is positioned proximate to the nanoscale fin along a coupling length such that the pump laser light propagating within the waveguide is coupled into the nanoscale fin from evanescent wave overlap along the coupling length. The pump laser light causes the first material to absorb the probe laser light when energy emitted by the RF emitter is at one or more frequencies dependent on a magnetic field. The device further includes a processor configured to determine a magnetic field strength of the magnetic field based on an identification of the one or more frequencies.

Methods are disclosed for fabricating molds for forming eyepieces having waveguides with integrated spacers. The molds are formed by etching deep holes (e.g., 5 μm to 1000 μm deep) into a substrate using a wet etch or dry etch. The etch masks for defining the holes may be formed with a thick metal layer and/or multiple layers of different metals. A resist layer may be disposed over the etch mask. The resist layer may be patterned to form a pattern of holes, the pattern may be transferred to the etch mask, and the etch mask may be used to transfer the pattern into the underlying substrate. The patterned substrate may be utilized as a mold onto which a flowable polymer may be introduced and allowed to harden. Hardened polymer in the holes may form integrated spacers. The hardened polymer may be removed from the mold to form a waveguide with integrated spacers.

A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (θ+90°*n), wherein θ is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.

A method for fabricating a thick crack-free dielectric film on a wafer for device fabrication is disclosed herein. A stress-release pattern is fabricated in an oxide layer of the wafer, which surrounds a number of device regions. The stress-release pattern comprises a plurality of recessions, which are spaced periodically along at least one direction. The plurality of recessions interrupt the continuous film during the dielectric film deposition, to prevent cracks from forming in the dielectric film and propagating into the device regions. Such that, a thick crack-free dielectric film can be achieved in the device regions, which are formed by patterning the dielectric layer. Furthermore, conditions of the dielectric film deposition process can be tuned to ensure quality of the deposited dielectric film. Still further, a plurality of deposition runs may be performed to deposit the thick crack-free dielectric film.

Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.