A method of making an article comprising one or more layers of plasmonic nanoparticles located between opposing layers of dielectric materials and an article comprising one or more layers of plasmonic nanoparticles located between opposing layers of dielectric materials.

A graded-index polymer waveguide (30) and a manufacturing method thereof are provided. The method includes providing a waveguide substrate (1); manufacturing a waveguide lower cladding layer (2) on a surface of the waveguide substrate (1); coating a material of a waveguide core layer (3) having UV photosensitivity on a surface of the waveguide lower cladding layer (2) away from the waveguide substrate (1); performing a hot imprinting process for the material of the waveguide core layer by means of a flexible transfer film mold and forming a waveguide core layer (3) having an imprinted waveguide link structure; performing a heat treatment process for the waveguide core layer (3); performing a pre-exposure process for the waveguide core layer; coating a waveguide upper cladding layer on a surface of a waveguide core layer (3); and curing the waveguide core layer (3) and the waveguide upper cladding layer (4).

Configurations are disclosed for multi-wavelength optical devices and systems. In particular, multi-wavelength optical devices that include separate chips optically connected via phonic wire bonds. The disclosed configurations can utilize photonic wire bond interconnects and photonic wire bond interconnection techniques, which may facilitate low-cost implementation of wavelength division multiplexed optical systems.

Disclosed is a polymeric waveguide for propagating light therein along width and length dimensions of the polymeric waveguide. The polymeric waveguide has a first curved surface on one side thereof and a second curved surface on an opposite second side thereof, and a refractive index spatially varying through a thickness thereof between the first curved surface and the second curved surface. The polymeric waveguide is curved in a cross-section comprising at least one of the width and length dimensions.

Provided is a meta-optics including a waveguide layer including a first surface and a second surface opposite to the first surface; and a plurality of meta units provided on the waveguide layer, each meta unit of the plurality of meta units including a grating configured to diffract incident light of a predetermined wavelength, a first electrode provided under the grating, a dielectric layer provided over the grating, and a second electrode provided on the dielectric layer, wherein a dielectric constant of the grating and a reflectance of the grating with respect to incident light change based on a voltage applied to the first electrode and the second electrode.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.

A photonic integrated circuit (PIC) includes an organic solid crystal (OSC) material layer, the OSC material layer having a substrate portion and a raised optical element integral with and extending from the substrate portion. The raised optical element may include a passive or active component of the photonic integrated circuit.

Provided is a resin composition for optical waveguide cores, the resin composition including liquid epoxy resin, and solid epoxy resin, in which a coefficient of variation calculated from a weighted average value of a refractive index of the liquid epoxy resin and a refractive index of the solid epoxy resin is 2.10% or less.

A circuit board substrate includes a reinforcing element embedded in a resin material. The reinforcing element includes an optical waveguide. The circuit board substrate can be used in electronic devices as a printed circuit board or the like. A circuit board substrate for use in electronic devices can be formed by embedding a reinforcing element comprising an optical waveguide in a resin. The optical waveguide can be coupled to optical signal transmission and reception elements to transmit an optical signal through the reinforcing element. The optical waveguide may be an optical fiber or the like in some examples.

A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45° angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.