The present invention provides a polymer optical waveguide having a core, an under cladding and an over cladding, in which: the polymer optical waveguide has a first section on one end side in the light propagation direction where no portion of the over cladding exists and the core and the under cladding are exposed, and a second section on the other end side in the light propagation direction where the core is covered with the under cladding and the over cladding; and a relative refractive index difference among the core, the under cladding and the over cladding, a core width and core height in an end surface at the one end side of the first section, and a core width and core height in an end surface at the other end side of the second section satisfy predetermined relationships.

The invention relates to an optical waveguide with at least one core region (1) extending along the longitudinal extent of the optical waveguide, and with a first jacket (2) which, viewed in the cross section of the optical waveguide, surrounds the core region (1). The invention further relates to an optical arrangement with such an optical waveguide, and to a method for producing the optical waveguide. The object of the invention is to make available an optical waveguide for high-performance operation, which is improved in relation to the prior art in terms of mode instability. The invention achieves this object by virtue of the fact that the optical waveguide consists of crystalline material at least in the core region (1).

Disclosed is a package comprising a substrate having a patterned surface with an optical contact area, an optical redistribution layer (oRDL) feature, and a build-up material extending over the patterned surface of the substrate and around portions of the oRDL features. In some embodiments, the package comprises a liner sheathing the oRDL features. In some embodiments, the oRDL feature extends through openings in an outer surface of the build-up material and forms posts extending outward from the outer surface. In some embodiments, the package comprises an electrical redistribution layer (eRDL) feature, at least some portion of which overlap at least some portion of the oRDL feature. In some embodiments, the package comprises an optical fiber coupled to the oRDL features.

Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.

Disclosed herein are apparatuses that include a first layer that includes glass and a plurality of waveguides disposed in the glass; a second layer that includes a second layer polymer and a plurality of waveguides disposed in the second layer polymer; and a third layer that includes a third layer polymer and a plurality of waveguides disposed in the third layer polymer.

Three-dimensional flexible photonic integrated circuits on silicon are fabricated in semiconductor wafer form and then transferred to Silicon-on-Polymer (SOP) substrates. SOP provides flexibility for conformal mounting with devices capable of maintaining performance when dynamically deformed to allow routing of light in x, y and z directions. Bonding a wafer or individual die of III-V semiconductor, such as Gallium Arsenide or similar photonic material, to the flexible silicon creates an active region for lasers, amplifiers, modulators, and other photonic devices using standard processing. Mounting additional photonic devices to the opposite side of a flexible photonic waveguide produces a stack for three-dimensional devices. Multiple flexible photonic waveguides may be stacked to increase functionality by transferring light between stacked waveguides. The flexible photonic circuit allows for integration of photonic devices such as low threshold lasers, tunable lasers, and other photonic integrated circuits with flexible Complementary Metal Oxide Semiconductor (CMOS) integrated circuits.

Apparatuses including integrated circuit (IC) optical assemblies and processes for operation of IC optical assemblies are disclosed herein. In some embodiments, the IC optical assemblies include a transmitter component to provide light output having a particular beam direction, and a transmitter driver component. The transmitter component includes a light source optically coupled to a plurality of waveguides, a plurality of gratings, and a plurality of phase tuners. The transmitter driver component causes a light provided by the light source to be centered at a particular wavelength and a particular phase to be induced by each phase tuner of the plurality of phase tuners on a respective waveguide of the plurality of waveguides, in accordance with a feedback signal, to generate the light output having the particular beam direction.

A light pipe such as a fiber ribbon may be formed from fibers joined by binder such as extruded binder. The fiber ribbon or other light pipe may have bends. A light source may provide light to an input of a fiber ribbon that is guided by the fiber ribbon to a corresponding output. The output may be located in an interior portion of an electronic device or may be positioned so that light from the output exits the electronic device and illuminates external objects. The light source may have light-emitting devices on a substrate. The light-emitting devices may be vertical cavity surface-emitting laser diodes or other lasers and/or may be light-emitting diodes. Light-emitting devices may be arranged in discrete clusters corresponding to the locations of fiber cores in the fiber ribbon.

An optical connection structure includes a first optical waveguide, a second optical waveguide, and an optical element. The first optical waveguide includes a first light incidence/emission end face (104) formed on one end side. In addition, the second optical waveguide includes a second light incidence/emission end face formed on one end side. One end side of the first optical waveguide and one end side of the second optical waveguide are arranged facing each other. The optical element is arranged in contact with the first light incidence/emission end face and the second light incidence/emission end face between the first optical waveguide and the second optical waveguide.

The present invention provides certain CHIP films and coatings, as well as the preparation and uses thereof. Chalcogenide hybrid organic/inorganic polymers or CHIPs may be suitable for use in antireflection coatings for use with infrared optics, for example as applied to lenses for infrared cameras. The coatings may be applied with spin coating and have a thickness related to the quarter wavelength of the desired infrared wavelengths.