An output coupler can be used to couple multiple channels of light from a semiconductor waveguide to an optical fiber for wavelength division multiplexing. To couple light of a wide bandwidth (e.g., equal to or greater than 100 nm), two symmetrical gratings on two sides of a Fabry Perot cavity is used. The two symmetrical gratings are optimized to both reflect light for a Fabry Perot resonator and couple light out of the semiconductor waveguide.

An output coupler can be used to couple multiple channels of light from a semiconductor waveguide to an optical fiber for wavelength division multiplexing. To couple light of a wide bandwidth (e.g., equal to or greater than 100 nm), two symmetrical gratings on two sides of a Fabry Perot cavity is used. The two symmetrical gratings are optimized to both reflect light for a Fabry Perot resonator and couple light out of the semiconductor waveguide.

Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in an integrated circuit, a multi-wavelength grating coupler, and first and second optical sources coupled to the integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical sources, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.

Methods and systems for a bi-directional receiver for standard single-mode fiber based on grating couplers may include, in an integrated circuit, a multi-wavelength grating coupler, and first and second optical sources coupled to the integrated circuit: coupling first and second source optical signals at first and second wavelengths into the photonically-enabled integrated circuit using the first and second optical sources, where the second wavelength is different from the first wavelength, receiving a first optical data signal at the first wavelength from an optical fiber coupled to the multi-wavelength grating coupler, and receiving a second optical data signal at the second wavelength from the optical fiber. Third and fourth optical data signals at the first and second wavelengths may be communicated out of the optoelectronic transceiver via the multi-wavelength grating coupler.

A coupling device including, integrated in or on a substrate, a waveguide capable of guiding a light beam centered on a central wavelength .sub.0 and an optical coupler. The waveguide and the optical coupler extend in two superposed stages of the coupling device. The optical coupler is composed of at least one index gradient structure. The average optical index in the index gradient structure varies monotonously, decreasing with increasing distance from the waveguide, the average optical index being an average value of the optical index in a cubic volume with a side dimension equal to: $\frac{{}_0}{2*n_{\mathrm{eff}}}$
in which n.sub.eff is the effective index of guided mode in the waveguide.

A coupling device including, integrated in or on a substrate, a waveguide capable of guiding a light beam centered on a central wavelength .sub.0 and an optical coupler. The waveguide and the optical coupler extend in two superposed stages of the coupling device. The optical coupler is composed of at least one index gradient structure. The average optical index in the index gradient structure varies monotonously, decreasing with increasing distance from the waveguide, the average optical index being an average value of the optical index in a cubic volume with a side dimension equal to: $\frac{{}_0}{2*n_{\mathrm{eff}}}$
in which n.sub.eff is the effective index of guided mode in the waveguide.

Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle ? relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ? between the ion beam and a surface normal of the gratings. The gratings have slant angles ? relative to the surface normal of the substrates. The rotation angles ? selected by an equation ?=cos.sup.?1 (tan(?)/tan(?)).

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.