A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

An optical device and a method of forming an optical device having multi-depth optical device structures with a refractive index greater than or equal to 2.0 are provided. The optical devices and method include forming first matrix stack structures and second matrix stack structures. Adjacent first matrix stack structures form first vias having a first depth and adjacent second matrix stack structures form second vias having a second depth. The first depth of the first vias being different than the second depth of the second vias provides from the formation of submicron, multi-depth optical device structures when the vias are backfilled with a device material.

Embodiments herein relate to systems, apparatuses, or processes directed to an integrated optical coupler that may be used to optically couple a waveguide and a PIC. In embodiments, the integrated optical coupler may include an optical diffraction grating mechanism, an optical lens, and a Faraday rotator. In embodiments, the integrated optical coupler may at least partially within a housing. Other embodiments may be described and/or claimed.

Embodiments herein relate to systems, apparatuses, or processes directed to an integrated optical coupler that may be used to optically couple a waveguide and a PIC. In embodiments, the integrated optical coupler may include an optical diffraction grating mechanism, an optical lens, and a Faraday rotator. In embodiments, the integrated optical coupler may at least partially within a housing. Other embodiments may be described and/or claimed.

An optical device is formed on an optical integrated circuit (IC) chip. The optical device includes: an optical circuit, a first grating coupler, a second grating coupler, a first 1×2 coupler, and a second 1×2 coupler. The first 1×2 coupler is equipped with a first optical port provided at a single-port end and a second optical port and a third optical port provided at a two-port end. The second 1×2 coupler is equipped with a fourth optical port provided at a single-port end and a fifth optical port and a sixth optical port provided at a two-port end. The first grating coupler is coupled to the first optical port. The second optical port is coupled to the optical circuit. The third optical port is coupled to the fourth optical port. The fifth optical port is coupled to the second grating coupler.

Embodiments described herein relate to a light coupler, a photonic integrated circuit, and a method for manufacturing a light coupler. The light coupler is for optically coupling to an integrated waveguide and for out-coupling a light signal propagating in the integrated waveguide into free space. The light coupler includes a plurality of microstructures. The plurality of microstructures is adapted in shape and position to compensate decay of the light signal when propagating in the light coupler. The plurality of microstructures is also adapted in shape and position to provide a power distribution of the light signal when coupled into free space such that the power distribution corresponds to a predetermined target power distribution. Each of the microstructures forms an optical scattering center. The microstructures are positioned on the light coupler in accordance with a non-uniform number density distribution.

A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45° angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.

An optical structure includes a grating coupler and a microlens. The grating coupler is configured to receive a laser light. The microlens is above the grating coupler, in which a metal shielding covers the microlens and has an opening to allow the laser light entering an effective coupling region of the grating coupler.

An optical structure includes a grating coupler and a microlens. The grating coupler is configured to receive a laser light. The microlens is above the grating coupler, in which a metal shielding covers the microlens and has an opening to allow the laser light entering an effective coupling region of the grating coupler.

An optical system includes a light module, an optical element on a first grating coupler, and a second grating coupler. The light module emits three beams from different positions. The optical element is below the light module and is configured to change incident angles of the three beams and to focus the three beams at the same region of the first grating coupler. The first grating coupler is below the optical element and is configured to couple the three beams into a light-guide substrate. The light-guide substrate is connected to the first grating coupler and is configured to transmit the three beams. The second grating coupler is connected to the light-guide substrate and is configured to enable the three beams departing from the light-guide substrate after the three beams have traveled the same optical path.