The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

A system for three dimensional imaging includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical circuitry connected to the light source; a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals; and a signal processing circuit connected with the light sensor circuitry and configured to extract 3D information of the object from the electrical signals. A mobile phone having the system and a method for three dimensional imaging are also provided.

A system for three dimensional imaging includes: a light source; a modulator connected with the light source and configured to modulate output of the light source with a frequency sweep signal; an optical circuitry connected to the light source; a light sensor circuitry connected with the optical circuitry and configured to sense optical output of the optical circuitry and convert the optical output into a plurality of electrical signals; and a signal processing circuit connected with the light sensor circuitry and configured to extract 3D information of the object from the electrical signals. A mobile phone having the system and a method for three dimensional imaging are also provided.

Methods and systems for partial integration of wavelength division multiplexing and bi-directional solutions are disclosed and may include, an optical transceiver on a silicon photonics integrated circuit coupled to a planar lightwave circuit (PLC). The silicon photonics integrated circuit may include a first modulator and first light source that operates at a first wavelength and a second modulator and second light source that operates at a second wavelength. The transceiver and PLC are operable to modulate a first continuous wave (CW) optical signal from the first light source utilizing the first modulator and modulate a second CW optical signal from the second light source utilizing the second modulator. The modulated signals may be communicated from the modulators to the PLC utilizing a first pair of grating couplers in the IC and combined in the PLC.

Methods and systems for partial integration of wavelength division multiplexing and bi-directional solutions are disclosed and may include, an optical transceiver on a silicon photonics integrated circuit coupled to a planar lightwave circuit (PLC). The silicon photonics integrated circuit may include a first modulator and first light source that operates at a first wavelength and a second modulator and second light source that operates at a second wavelength. The transceiver and PLC are operable to modulate a first continuous wave (CW) optical signal from the first light source utilizing the first modulator and modulate a second CW optical signal from the second light source utilizing the second modulator. The modulated signals may be communicated from the modulators to the PLC utilizing a first pair of grating couplers in the IC and combined in the PLC.

Methods and systems enable amplifying optical signals using a Bragg reflection waveguide (BRW) having second order optical nonlinearity to generate an optical pump by injection locking. The BRW may also be used for parametric amplification of optical signals using the optical pump. Feedback phase-power control may be performed to maximize output power.

An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.

To provide a multiplexer that makes it possible to achieve a reduction in size and that minimizes the influence of the expansion of laser light on a multiplexing unit. A multiplexer is provided with a plurality of waveguides, multiplexing units that are provided at an intermediate location within the waveguides, and laser light sources, wherein: the first multiplexing unit is arranged at a position that is closest to the laser light sources; and the laser light sources that have an optical axis at a position that is separated from the transmission axis of the visible light that is introduced into the first multiplexing unit are arranged so that the optical axis is inclined with respect to the transmission axis and the outer periphery of laser light that expands at a predetermined expansion angle passes in front of the first multiplexing unit.

A device includes an optical splitter comprising a plurality of splitter outputs. The splitter outputs are out of phase and include a non-uniform phase front. The device includes a one-dimensional phase compensation array communicating with the optical splitter. The phase compensation array receives the non-uniform phase front and outputs a uniform phase front. The phase compensation array includes a plurality of array outputs. The device includes a tunable linear gradient phase shifter communicating with said phase compensation array to impart a linearly-varying phase shift across said plurality of array outputs, thereby steering a beam along a first angle in a first plane. The device includes a waveguide grating out-coupler communicating with said linear gradient phase shifter, and a uniform phase shifter communicating with the waveguide grating out-coupler. The uniform phase shifter steers the flat phase front along a second angle in a second plane perpendicular to said first plane.

A device includes an optical splitter comprising a plurality of splitter outputs. The splitter outputs are out of phase and include a non-uniform phase front. The device includes a one-dimensional phase compensation array communicating with the optical splitter. The phase compensation array receives the non-uniform phase front and outputs a uniform phase front. The phase compensation array includes a plurality of array outputs. The device includes a tunable linear gradient phase shifter communicating with said phase compensation array to impart a linearly-varying phase shift across said plurality of array outputs, thereby steering a beam along a first angle in a first plane. The device includes a waveguide grating out-coupler communicating with said linear gradient phase shifter, and a uniform phase shifter communicating with the waveguide grating out-coupler. The uniform phase shifter steers the flat phase front along a second angle in a second plane perpendicular to said first plane.