An optical coupling apparatus is disclosed, including: a monochromatic light source configured to emit monochromatic light; a monochromatic light photodetector configured to receive the monochromatic light; and a monochromatic light transmission medium, wherein at least a portion of the monochromatic light transmission medium is disposed between the monochromatic light source and the monochromatic light photodetector, and the monochromatic light is transmitted to the monochromatic light photodetector via the monochromatic light transmission medium, wherein a wavelength of the monochromatic light is shorter than a wavelength of infrared light. Embodiments of the present disclosure provide an optical coupling apparatus with a higher upper limit of operating frequency, which may better meet user requirements.

Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (EICs), forming a second wafer including a plurality of photonic integrated circuits (PICs), bonding the first wafer to the second wafer to form a first stacked wafer. The bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the EICs with one of the plurality of the PICs.

A photoelectric adapter includes a power sourcing equipment (PSE) device, an optical connector connection part and an electrical connector. The electrical connector is connectable to an electrical connector connection part of an electrical device. The PSE device includes a semiconductor laser that oscillates with electric power, thereby outputting feed light. The PSE device is driven by receiving the electric power supplied from the electrical device through the electrical connector, and outputs the feed light from the optical connector connection part. Another photoelectric adapter includes a powered device, an optical connector connection part and an electrical connector. The powered device includes a photoelectric conversion element that converts feed light into electric power. The powered device receives the feed light supplied through the optical connector connection part, converts the feed light into the electric power, and outputs the electric power from the electrical connector.

An apparatus for measuring spectral components of Raman-scattered light emitted by target. The apparatus includes: pulsed laser light source to emit light; probe optics to direct light towards target and to collect light scattered by target; optical spectrometer including: input divider to divide collected light into first and second light beams; first spectrograph including input apertures for receiving said light beams and optical disperser to disperse said light beams; second spectrograph comprising input apertures and output apertures; and spatial light modulator to receive dispersed first and second light beams and to selectively provide at least part of at least one of dispersed first and second light beams to input aperture of second spectrograph which reverses dispersion of light beam and focuses light beam to output aperture; detector element to measure spectral components of light beam exiting output aperture. Optical spectrometer further includes delay line(s) line for delaying light beam(s).

A method and system for an optical package assembly is disclosed. According to one example, the optical package assembly includes a photonic integrated circuit (PIC) chip, at least one fiber coupled to the PIC chip, a fiber lid plate disposed on at least a portion of the at least one fiber, and a cover plate having a surface coupled to the PIC chip and the fiber lid plate.

A remote indicator system comprising a housing and a display unit located remotely from the housing. The housing comprises a first light source and a first end of an end-emitting fibre optic cable. The display unit comprises a second end of the fibre optic cable. The housing includes manual switching means configurable to allow light from the first light source to pass into the first end of the optical fibre cable and further configurable to prevent light from the first light source from passing into the first end of the optical fibre cable.

An optical transmission power supply cable includes an electric power input terminal, a power sourcing equipment and an optical fiber cable. The power sourcing equipment includes a semiconductor laser that oscillates with electric power input from the electric power input terminal, thereby outputting feed light. The optical fiber cable transmits the feed light from the power sourcing equipment. The optical fiber cable has an electrically insulating property of not conducting electricity in a longer direction thereof.

The method comprises the steps of A) equipping the end of the fiber with an added microstructure (MS) arranged so as to provide support on a surrounding structure forming a support (SE) distinct from the photonic device (PIL) and to prevent any contact with a sensitive surface (FA) of the photonic device, B) optimally aligning, in position and in angle, the fiber end with the sensitive surface, and C) exerting on the microstructure and/or the optical fiber a bearing pressure (P) against the surrounding support structure, maintaining an optimal spacing distance (D) and alignment between the fiber end and the sensitive surface.

A dynamic concentrator system having a concentrator lens, a tracker platform and a receiver. In an embodiment, the concentrator lens is configured to receive an incoming light at an entrance angle a and concentrate the light beam on a focus spot. The tracker platform has a detector optical aperture and one or more actuators. The detector optical aperture can be configured to receive the concentrated light beam. The actuators can move the detector optical aperture in a spatial plane to a location of the focus spot. The receiver has a detector optically coupled to the detector optical aperture to receive the concentrated light beam from the detector optical aperture.

A semiconductor package includes a semiconductor die, a device layer, an insulator layer, a buffer layer, and connective terminals. The device layer is stacked over the semiconductor die. The device layer includes an edge coupler located at an edge of the semiconductor package and a waveguide connected to the edge coupler. The insulator layer is stacked over the device layer and includes a first dielectric material. The buffer layer is stacked over the insulator layer. The buffer layer includes a second dielectric material. The connective terminals are disposed on the buffer layer and reach the insulator layer through contact openings of the buffer layer.